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Light emitting element

A technology of light-emitting elements and light-emitting units, which is applied in the direction of electrical components, semiconductor devices, electric solid-state devices, etc., to achieve the effects of inhibiting migration and improving light extraction efficiency

Active Publication Date: 2021-11-12
NICHIA CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, metal materials such as Ag used for electrodes are prone to migration

Method used

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  • Light emitting element
  • Light emitting element
  • Light emitting element

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Experimental program
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no. 1 approach >

[0037] [Structure of Light Emitting Element]

[0038] refer to Figure 1A ~ Figure 3G The structure of the light emitting element according to the first embodiment will be described.

[0039] also, Figure 1B The cross-sectional view shown shows the Figure 1A The section along the IB-IB line as a broken line in . In addition, in order to describe the laminated structure of the light emitting element, Figure 3A ~ Figure 3G It shows the state which laminated|stacked sequentially from the lower layer side. Figure 3A ~ Figure 3G Although it is a top view, hatching is drawn on the uppermost layer in each figure for convenience.

[0040] Such as Figure 1A ~ Figure 1C As shown, the light-emitting element 1 is formed in a substantially square shape in plan view, and includes: a substrate 11; a plurality of semiconductor light-emitting units 101-108, which are arranged on the upper surface side of the substrate and are electrically independent from each other; a light-reflecti...

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Abstract

The present invention relates to a light-emitting element that suppresses migration of metal materials used in electrodes and improves light extraction efficiency. The light emitting element (1) includes: a substrate (11); a light emitting unit (101) etc., which are provided on the upper surface side of the substrate; a light reflective electrode (13), which is provided on the upper surface of the light emitting unit, etc.; a first insulating layer , which continuously cover the side surfaces of the light emitting unit, etc., and between the side surfaces, and the side surfaces and the upper surface of the light reflective electrode; wiring electrodes, etc., which connect the light emitting units, etc. in series, and interpose the first insulating layer. Covering the sides of the light-emitting units and the like and between the sides; and a light-reflective metal layer, etc., which cover the sides of the adjacent two light-emitting units and the like through the first insulating layer, and are connected with the light-emitting units. Waiting for no conduction. A part of the light-reflective metal layer or the like covers a part of the upper surface of the light-reflective electrode provided on the upper surface of the light-emitting unit or the like via the first insulating layer.

Description

technical field [0001] The present invention relates to a light emitting element. Background technique [0002] A light-emitting element having a monolithically integrated structure is proposed in which a semiconductor laminate stacked on a single substrate is divided into a plurality of light-emitting units by providing grooves, and wiring is performed between the plurality of light-emitting units. Patent Document 1 describes a light emitting element in which a plurality of light emitting units are formed on a single substrate and mounted on a submount substrate in an upside down manner (see FIG. 6 ). [0003] Patent Document 1: Japanese Patent Laid-Open No. 2010-62592 [0004] For the light-emitting element described in Patent Document 1, since the light emitted from the side surface of each light-emitting unit is absorbed by the metal bump or enters other adjacent light-emitting units, it is difficult to obtain high light emission. extraction efficiency. In addition, i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/15H01L33/40H01L33/62H01L33/46H01L25/075
CPCH01L25/0753H01L27/153H01L33/405H01L33/46H01L33/62
Inventor 榎村惠滋井上芳树寸田高政
Owner NICHIA CORP