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Active atom supply source and integrated circuit having same

An integrated circuit and atomic technology, applied in circuits, electrical components, electrical solid devices, etc., can solve problems such as the deterioration of electromigration life

Active Publication Date: 2019-08-02
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This approach has its own disadvantages
When the conductor's current changes direction, a previously passive atom supply can become a passive atom sink, deteriorating the lifetime of electromigration

Method used

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  • Active atom supply source and integrated circuit having same
  • Active atom supply source and integrated circuit having same
  • Active atom supply source and integrated circuit having same

Examples

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Embodiment Construction

[0012] The following disclosure provides many different embodiments or examples for implementing different features of the presented subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are examples only and are not intended to be limiting. For example, in the following description, forming a first component over or on a second component may include an embodiment in which the first component and the second component are formed in direct contact, and may also include an embodiment in which an additional component is formed on the first component and the second component. Between the parts, such that the first part and the second part are not in direct contact with each other. Also, the present invention may repeat reference numerals and / or letters in various instances. This repetition is for the sake of brevity and clarity and does not in itself indicate a relationship between the various emb...

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Abstract

An integrated circuit (IC) includes a first conductor in one layer of the IC; a second conductor in another layer of the IC; and a first metal plug connecting the first conductor and the second conductor. The IC also includes an atom source conductor (ASC) in a layer of the IC and bonded to the first conductor and a second metal plug connecting the ASC to a voltage source of the IC. The first conductor and the ASC are configured to be bias connected to different voltages to establish an electron path from the second metal plug to the first metal plug such that the ASC acts as an active atom source for the first conductor. The invention also provides an active atom supply and an integrated circuit having the same.

Description

technical field [0001] Embodiments of the invention relate generally to the field of semiconductor technology, and more particularly to integrated circuits. Background technique [0002] Semiconductor integrated circuits (ICs) use metallized interconnects to connect individual devices on a chip. A major challenge to the continued scaling of IC technology is electromigration failure of metallized interconnects. Electromigration refers to the phenomenon of metal self-diffusion caused by electric current. In short, electromigration is the transport of conductor materials due to the exchange of momentum between electron currents ("electron wind" forces). Material depletion by electromigration will lead to tensile stress, while material accumulation will lead to compressive stress at the barrier boundary. Backflow fluxes are derived from stress gradients and electromigration fluxes are calculated. If the stress exceeds the critical value required for void nucleation, the wire...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/538
CPCH01L23/5384H01L23/5386H01L23/522H01L23/53223H01L23/53238H01L23/53252H01L23/5329H01L23/5226H01L23/5283H01L23/528H01L23/5286H01L23/58H01L27/0203
Inventor 林明贤欧东尼
Owner TAIWAN SEMICON MFG CO LTD