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Silicon-based MEMS array loudspeaker

A loudspeaker and array technology, which is applied in the field of loudspeakers to achieve the effects of reducing distortion, thin thickness and improving sound quality

Active Publication Date: 2017-08-18
BESTAR HLDG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the speakers on the market are usually moving coil speakers, moving iron speakers, piezoelectric speakers and electrostatic speakers. However, the market demands for thinner speakers and clearer sound quality. The entire electronics industry has digitized most of its products. and miniaturization, the existing loudspeakers can no longer meet the needs of the electronics industry

Method used

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  • Silicon-based MEMS array loudspeaker
  • Silicon-based MEMS array loudspeaker
  • Silicon-based MEMS array loudspeaker

Examples

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Embodiment Construction

[0030] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0031] Such as Figure 1 to Figure 3 , a silicon-based MEMS array speaker, comprising a substrate 1, 1024 MEMS micro-acoustic units 2, a plurality of MEMS micro-acoustic units arrayed on the substrate, and a single MEMS micro-acoustic unit is equilateral hexagonal in shape;

[0032] The MEMS microacoustic unit includes a diaphragm 21 as an intermediate electrode, an upper insulating sheet 22 and a lower insulating sheet 23 connected to the upper and lower surfaces of the diaphragm, an upper conductive plate 24 as an upper electrode, and a lower conductive plate 25 as a lower electrode. The upper conductive plate is installed On the upper insulating sheet, the lower conductive plate is installed on the lower insulating sheet, the upper insulating sheet and the lower insulating sheet are all provided with a central hole 26, the upper conductive p...

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PUM

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Abstract

The invention relates to a silicon-based MEMS array loudspeaker. The silicon-based MEMS array loudspeaker comprises a substrate and multiple MEMS micro-acoustic units; the multiple MEMS micro-acoustic units are arrayed on the substrate; each MEMS micro-acoustic unit comprises a vibrating diaphragm, an upper insulation sheet, a lower insulation sheet, an upper conductive plate and a lower conductive plate; the vibrating diaphragm is used as an intermediate electrode; the upper insulation sheet and the lower insulation sheet are connected to the upper and lower surfaces of the vibrating diaphragm; the upper conductive plate is used as an upper electrode; the lower conductive plate is used as a lower electrode; the upper conductive plate is installed on the upper insulation sheet; the lower conductive plate is installed on the lower insulation sheet; the upper insulation sheet and the lower insulation sheet are each provided with a centre hole; the upper conductive plate is provided with multiple pronunciation holes communicated with the centre hole; and the lower conductive plate is provided with a ventilation hole communicated with the centre hole. The silicon-based MEMS array loudspeaker disclosed by the invention has the characteristics of being thin in thickness, good in sound quality and the like.

Description

technical field [0001] The invention relates to the technical field of loudspeakers, in particular to a silicon-based MEMS array loudspeaker. Background technique [0002] At present, the speakers on the market are usually moving coil speakers, moving iron speakers, piezoelectric speakers and electrostatic speakers. However, the market demands for thinner speakers and clearer sound quality. The entire electronics industry has digitized most of its products. and miniaturization, the existing loudspeakers can no longer meet the needs of the electronics industry. Contents of the invention [0003] In view of the above technical problems, the present invention provides a silicon-based MEMS array loudspeaker that solves the above problems. [0004] Realize the technical scheme of the present invention as follows: [0005] A silicon-based MEMS array speaker, comprising a substrate, a plurality of MEMS micro-acoustic units, and a plurality of MEMS micro-acoustic units arrayed o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/02
CPCH04R19/02H04R2400/11Y02T90/00
Inventor 徐波徐金国吴逸飞朱志刚
Owner BESTAR HLDG
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