A kind of pcb board and its outer layer circuit manufacturing method
A technology of PCB board and manufacturing method, which is applied in the manufacture of printed circuits, removal of conductive materials by chemical/electrolytic methods, printed circuits, etc.
Active Publication Date: 2019-09-17
SHENZHEN KINWONG ELECTRONICS
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Problems solved by technology
[0004] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a PCB board and its outer layer circuit manufacturing method, aiming to solve the problems of existing PCB thick copper boards that are prone to edging and poor quality during the manufacturing process
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[0028] The present invention provides a PCB board and a method for making its outer layer circuit. In order to make the purpose, technical solution and effect of the present invention clearer and clearer, the present invention will be further described in detail below. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0029] see figure 1 , figure 1 It is a flow chart of a preferred embodiment of the method for making the outer layer circuit of a PCB board of the present invention, as shown in the figure, it includes steps:
[0030] S1. Cut the FR4 board, and then drill through holes and slots;
[0031] S2. Grinding the drilled FR4 plate through the abrasive belt grinding line;
[0032] S3. Grinding the FR4 board after grinding through a nylon needle brush grinding line, and then carrying out copper sinking treatment to obtain a PCB board;
[0033] S4. Lay the PCB board ...
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The invention discloses a PCB (Printed Circuit Board) and an outer layer circuit manufacturing method thereof. The manufacturing method comprises the steps of A, cutting an FR4 board, and then drilling via holes and slot holes; B, performing board grinding on the drilled FR4 board via an abrasive-belt board grinding line; C, performing board grinding on the ground FR4 board via a nylon pin brush board grinding line, then performing copper deposition treatment to acquire a PCB; then performing twice film pasting on the PCB, wherein the pressure of the second time of film pasting is 10-15% greater than the pressure of the first time of film pasting, the speed of the second time of film pasting is 10-20% slower than the speed of the first time of film pasting; and E, then sequentially performing exposure, development, etching and film stripping treatment. According to the invention, burr removing treatment is performed after drilling. In addition, twice dry film pasting is performed in outer layer circuit manufacturing, so that a quality problem caused by dry film breakage during dry film pasting in manufacturing an outer layer circuit of a thick-copper PCB is fundamentally solved.
Description
technical field [0001] The invention relates to the field of PCB manufacture, in particular to a method for manufacturing a PCB board and its outer layer circuit. Background technique [0002] Thick copper boards (circuit boards with inner base copper or outer copper thickness ≥ 2 oz) can carry large currents, reduce thermal strain and dissipate heat due to their relatively thick copper layers. They are widely used in communication equipment, aerospace, automobiles, and networks. Energy, planar transformers and power modules, etc. However, when the thick copper plate is drilled, due to the thicker copper layer, it is easy to produce edging. If the edging after drilling is not effectively eliminated, the dry film will be punctured when the outer layer is made and the dry film is attached, resulting in NPTH. The phenomenon of copper on the hole. In addition, for thick copper plates with slotted holes, if the area of the slot is too large, the position of the slot when the d...
Claims
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IPC IPC(8): H05K3/00H05K3/06
Inventor 付凤奇任城洵王俊
Owner SHENZHEN KINWONG ELECTRONICS