A Flat Micro Loop Heat Pipe with Capillary Capillary Force Variation

A loop heat pipe and capillary core technology, applied in indirect heat exchangers, lighting and heating equipment, cooling/ventilation/heating transformation, etc., can solve the uneven temperature of steam pipes, uneven fluid distribution, and uneven local heat transfer To achieve the effect of improving heat transfer and cooling efficiency, increasing heat transfer distance, and reducing flow resistance
CN107091582BActive Publication Date: 2018-04-20SHANDONG UNIV
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SHANDONG UNIV
Publication Date
2018-04-20

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Abstract

The invention provides a flat plate micro-loop heat pipe, which includes a main board and an upper cover plate, the upper cover plate and the main board are packaged together, the main board includes an evaporation chamber and a condensation chamber, and steam is connected between the evaporation chamber and the condensation chamber pipeline and liquid pipeline, the evaporation chamber communicates with the liquid pipeline through a capillary force channel; a porous medium sheet is arranged in the evaporation chamber, and the capillary force of the porous medium sheet is along the direction of the liquid pipeline to the steam pipeline, along the direction of the capillary force of the porous medium capillary wick direction, the capillary force of the porous media sheet at different positions is gradually enhanced. In the present invention, the capillary force of the capillary wick at different positions of the porous medium sheet is gradually enhanced, so that the upper part can quickly absorb the liquid and increase the amount of the upper fluid, so that it enters the upper steam pipe after the upper part evaporates, thereby To achieve the purpose of uniform fluid distribution and uniform temperature distribution.
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Description

technical field

[0001] The invention belongs to the field of heat exchangers, in particular to a flat-plate miniature loop heat pipe system. Background technique

[0002] With the rapid development of microelectronics and information technology, the high integration and miniaturization of devices and circuits has become an important development trend, but the increase in the heat generation intensity and temperature per unit area of ​​the chip brought about by the increase in integration will seriously threaten devices and devices. Equipment reliability. Studies have found that microelectronic chips have the characteristics of uneven surface heat distribution, and the heat flux intensity at some local hot spots can even be as high as 1000w / cm2, which is considered to be the key reason for chip failure or even damage. For this reason, the development of a micro-cooler that directly cools the chip and improves its overall temperature uniformity has become a hot spot in therma...

Claims

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