Turret type test device fast disassembling IC test base

A test device and turret-type technology, applied in the field of quick-release IC test sockets, can solve problems such as affecting the test pass rate and efficiency, slow disassembly and assembly, and wrong assembly.

Active Publication Date: 2017-08-29
KING YUAN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, the process of such disassembly and reassembly is not only slow and time-consuming, but also is easy to be easily confused when reassembling because the operator does not know the corresponding connection position of each radio frequency signal line on the IC interface board 14 to be tested. If the installation is wrong, the test will be abnormal, especially when the number of connected RF signal lines is more, it is easier to cause such a phe

Method used

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  • Turret type test device fast disassembling IC test base
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Embodiment Construction

[0039] Some embodiments of the invention are described in detail below. However, the invention can be broadly practiced in other embodiments than this detailed description. That is to say, the scope of the present invention is not limited by the proposed embodiments, but is subject to the protection scope of the patent claims of the present invention. Secondly, when each element or step in the illustrations of the embodiments of the present invention is described as a single element or step, it should not be regarded as a limited cognition, that is, when the following description does not particularly emphasize the limitation on the number of the present invention The spirit and scope of application of the invention can be extended to structures and methods in which multiple elements or structures coexist. Furthermore, in this specification, different parts of each element are not drawn in full scale, and some dimensions are exaggerated or simplified compared with other relev...

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Abstract

The invention relates to a turret type test device fast disassembling IC test base. The turret type test device fast disassembling IC test base comprises a pedestal, an IC interface board to be tested, a test base, an adapter base and multiple radio frequency signal lines. The fast disassembling IC test base can be connected with more radio frequency signal lines, can avoid mutual interference and winding of the radio frequency signal lines and can be fast and simply disassembled and assembled in the turret type test device without generating the problems of false connection and damage of the radio frequency signal lines.

Description

technical field [0001] The present invention relates to a quick-release IC test socket of a turret-type test device, in particular to a quick-release IC test socket of a turret-type test device for high-frequency testing. Background technique [0002] With the advancement and generalization of wireless communication technology, and the demand for IC size reduction and multi-function, the IC structure gradually adopts the design of small chips with multiple radio frequency functions, which means that a single IC chip no longer only has a single radio frequency (RF) Function, but with a variety of radio frequency functions, and the size of the IC is more reduced. After the production of these ICs with multiple radio frequency functions is completed, it is often necessary to perform various radio frequency tests on the IC to confirm the various radio frequency functions of the IC. Because such ICs are small in size, in order to increase the efficiency of testing, turret testin...

Claims

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Application Information

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IPC IPC(8): G01R1/04G01R31/28
CPCG01R31/2863
Inventor 李煜山
Owner KING YUAN ELECTRONICS
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