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Array substrate, preparation method thereof and display device

A technology of array substrates and substrate substrates, which is applied in the manufacture of semiconductor/solid-state devices, semiconductor devices, electrical components, etc., can solve the problems of uneven cross-section of the edge of the array substrate and affect the cutting yield, and achieve the effect of improving the flatness of cutting

Active Publication Date: 2017-09-05
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the array substrate is formed by cutting the array substrate motherboard, the existence of the leads will cause uneven stress during cutting, resulting in uneven cross-section of the edge of the array substrate, which will affect the cutting yield. The edge cross-section of the array substrate is as follows: figure 2 shown

Method used

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  • Array substrate, preparation method thereof and display device
  • Array substrate, preparation method thereof and display device
  • Array substrate, preparation method thereof and display device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] image 3 A schematic cross-sectional structure diagram of an edge region of an array substrate 1 provided in this embodiment is shown. It should be noted, image 3 Only a part of the relevant structure of the array substrate 1 is shown for a clearer description.

[0033] Such as image 3 As shown, the array substrate 1 of this embodiment includes an edge area and leads 21 located in the edge area, and also includes a base substrate 10, which is characterized in that an auxiliary structure 22 is provided in the edge area, and the auxiliary structure 22 is on the base substrate 10 The orthographic projection on covers the base substrate 10 in the edge region. Since the auxiliary structure 22 has the same or similar cutting stress as that of the lead wire 21 during cutting to form the edge area, the cutting flatness of the edge area of ​​the array substrate 1 is improved.

[0034] For example, the lead wire 21 and the auxiliary structure 22 may be made of the same mate...

Embodiment 2

[0045] Figure 4 and Figure 5 A schematic cross-sectional structure diagram of an edge region of an array substrate 1 provided in this embodiment is shown. It should be noted, Figure 4 and Figure 5 Only a part of the relevant structure of the array substrate 1 is shown for a clearer description.

[0046] Such as Figure 4 and Figure 5 As shown, the array substrate 1 of this embodiment includes an edge area and leads 21 located in the edge area, and also includes a base substrate 10, which is characterized in that an auxiliary structure 22 is provided in the edge area, and the auxiliary structure 22 is on the base substrate 10 The area of ​​the base substrate 10 covered by the orthographic projection on the base substrate 10 coincides with the edge area of ​​the base substrate 10 not covered by the orthographic projection of the leads 21 on the base substrate 10 . Since the auxiliary structure 22 has the same or similar cutting stress as that of the lead wire 21 durin...

Embodiment 3

[0060] This embodiment provides a display device, which includes the array substrate 1 of any of the above embodiments, and may further include a gate driving circuit, a data driving circuit, a power supply, and the like. The display device can be any product or component with a display function, such as a display panel, a television, a digital camera, a mobile phone, a watch, a tablet computer, a notebook computer, a navigator, and the like.

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Abstract

The invention discloses an array substrate, a preparation method thereof and a display device. Through an auxiliary structure arranged on the edge area of the array substrate, the orthographic projection of the auxiliary structure of the edge area and a lead on a substrate base plate covers the substrate base plate of the edge area; when the edge area is formed by cutting, the auxiliary structure the same as or similar to the cutting stress of the lead is obtained, and then the cutting flatness of the edge area of the array substrate is improved.

Description

technical field [0001] Embodiments of the present invention relate to the field of display technology, and in particular to an array substrate, a manufacturing method thereof, and a display device having the array substrate. Background technique [0002] In the field of display technology, especially in the field of organic electroluminescence display, there is a design requirement for narrow borders. Due to its relatively larger display area and better display effect, the narrow bezel can attract consumers' favor, and can also help improve the glass utilization rate of products. However, narrow borders often have certain technical problems in terms of product design and product yield. In the existing production process, the array substrate needs to be inspected, and in order to achieve narrow borders and save space, it is now common to lead the signal lines out of the array substrate through leads for inspection, such as figure 1 shown. Since the array substrate is forme...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/12H01L21/77
CPCH01L27/1218H01L27/1262
Inventor 刘庭良张锴
Owner BOE TECH GRP CO LTD