Method for rapid production of qualified flexible circuit board

A flexible circuit board, qualified technology, applied in the direction of printed circuit, printed circuit manufacturing, electrical components, etc., can solve the problems of low production efficiency, waste of manpower and material resources, and it is difficult to completely detect unqualified finished products, so as to improve production efficiency. Effect

Active Publication Date: 2017-09-29
苏州市华扬电子有限公司
View PDF6 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the existing production method of flexible circuit boards is to directly die-cut products, and test individual products one by one. Low, waste manpower and material resources, and it is difficult to completely detect unqualified finished products; for this reason, we have developed a method for quickly producing qualified flexible circuit boards that can judge whether the flexible circuit board is qualified by visual inspection

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for rapid production of qualified flexible circuit board
  • Method for rapid production of qualified flexible circuit board
  • Method for rapid production of qualified flexible circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0020] attached Figure 1-6 The method for rapidly producing a qualified flexible circuit board according to the present invention includes the following steps, taking the design requirement of tolerance 0.2mm as an example:

[0021] 1. Using the copper etching method, the circuits of a plurality of regularly arranged flexible circuit boards 4 and the process rings 2 distributed diagonally on the raw material plate 1 are copper-etched out on the original material plate 1; the process ring 2 includes concentric 1.4mm*1.8mm inner copper ring 6 and outer copper ring 8 with an inner diameter of 2.4mm;

[0022] 2. While punching the flexible circuit board 4, punch a round punch hole 5 in the inner ring of the 1.4mm*1.8mm inner copper ring 6, with an aperture of 1.0mm; Between the outer copper ring 8, punch a small hole 7 with a diameter ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a method for rapid production of qualified flexible circuit boards. The method includes the steps of using a copper corrosion method for copper etching of circuits of a plurality of regularly arranged flexible circuit boards on raw material boards and process rings including inner copper rings on the raw material boards; punching round punch holes in the inner rings of the inner copper rings while punching the flexible circuit boards to obtain the flexible circuit boards, waste material areas and round punch holes in the process rings in the waste material areas; visually checking whether the round punch holes in the waste material areas are tangential to the inner copper rings in the process rings. If yes, the punched flexible circuit boards are unqualified, otherwise the punched flexible circuit boards are qualified. The method can realize qualification detection by visually checking whether the round punch holes in the waste material area are tangential to the inner copper rings in the process rings. The method is simple and convenient, and improves production efficiency.

Description

technical field [0001] The invention relates to an improvement of a production method of a flexible circuit board, in particular to a method for rapidly producing a qualified flexible circuit board that can judge whether the flexible circuit board is qualified by visual inspection. Background technique [0002] At present, the existing production method of flexible circuit boards is to directly die-cut products, and test individual products one by one. Low, waste manpower and material resources, and it is difficult to completely detect unqualified finished products; for this reason, we have developed a method for quickly producing qualified flexible circuit boards that can judge whether the flexible circuit board is qualified by visual inspection. Contents of the invention [0003] The object of the present invention is to overcome the deficiencies of the prior art and provide a method for quickly producing qualified flexible circuit boards that can judge whether the flexi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H05K3/00B26F1/38B26F1/02B26D7/27
CPCB26D7/27B26F1/02B26F1/38H05K3/0052H05K2203/0228H05K2203/163
Inventor 金长帅吴应官
Owner 苏州市华扬电子有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap