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Electronic apparatus, ultrasonic fingerprint recognizing apparatus and manufacturing method thereof

A manufacturing method and fingerprint recognition technology, which is applied in the field of electronic equipment and ultrasonic fingerprint recognition devices, can solve problems such as low loop efficiency and restrict the recognition sensitivity of ultrasonic fingerprint recognition devices, achieve high loop efficiency, improve ultrasonic receiving efficiency, and improve ultrasonic emission efficiency effect

Active Publication Date: 2017-10-03
SILEAD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the current scheme of an ultrasonic fingerprint recognition device using a single piezoelectric material tends to cause low loop efficiency (loop efficiency=transmitting efficiency×receiving efficiency), thereby restricting the recognition sensitivity of the ultrasonic fingerprint recognition device

Method used

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  • Electronic apparatus, ultrasonic fingerprint recognizing apparatus and manufacturing method thereof
  • Electronic apparatus, ultrasonic fingerprint recognizing apparatus and manufacturing method thereof
  • Electronic apparatus, ultrasonic fingerprint recognizing apparatus and manufacturing method thereof

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Embodiment Construction

[0053] In order to enable those skilled in the art to better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described The embodiments are only some of the embodiments of the present application, but not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the scope of protection of this application.

[0054]Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the scope of protection of this application. For example, in the following description, forming the second component above the first component may include an embodiment in wh...

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Abstract

The embodiment of the application provides an electronic apparatus, an ultrasonic fingerprint recognizing apparatus and a manufacturing method thereof. The method comprises: a first piezoelectric layer having a specific piezoelectric strain constant is formed at the top of a substrate layer; a first planar electrode is formed at the top of the first piezoelectric layer; a second piezoelectric layer having a specific piezoelectric voltage constant is formed at the top of the first planar electrode; a second planar electrode is formed at the top of the second piezoelectric layer; a resonant cavity is formed at the substrate layer and a third planar electrode is formed in the resonant cavity to form a first device, wherein the first planar electrode, the second piezoelectric layer, and the second planar electrode are used for realizing ultrasonic wave transmitting and the third planar electrode, the first piezoelectric layer, the second piezoelectric layer, and the second planar electrode are used for realizing ultrasonic wave receiving; and the first device and a cooperative semiconductor device are integrated to form an ultrasonic fingerprint recognizing apparatus. Therefore, the loop efficiency and the recognition sensitivity of the ultrasonic fingerprint recognizing apparatus are improved.

Description

technical field [0001] The present application relates to the technical field of ultrasonic fingerprint identification, in particular to an electronic device, an ultrasonic fingerprint identification device and a manufacturing method thereof. Background technique [0002] In the ultrasonic fingerprint identification technology, the main function of the ultrasonic fingerprint identification device is to convert the excitation signal into an ultrasonic wave and emit it in a direction perpendicular to the fingerprint, and at the same time receive the ultrasonic wave reflected by the fingerprint and convert it into a corresponding electrical signal. Therefore, the design of the ultrasonic fingerprint identification device is very critical. [0003] In the design of ultrasonic fingerprint identification device, the preparation of piezoelectric material is also a key point. The piezoelectric materials currently used are generally AlN, lead zirconate titanate piezoelectric ceramic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K9/00G07C9/00H01L41/113H10N30/30
CPCG07C9/00563G06V40/1306H10N30/302
Inventor 不公告发明人
Owner SILEAD
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