Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Electronic equipment, ultrasonic fingerprint identification device and manufacturing method thereof

A manufacturing method and fingerprint recognition technology, which is applied in character and pattern recognition, acquisition/organization of fingerprints/palmprints, circuits, etc., can solve problems such as low loop efficiency and restriction of recognition sensitivity of ultrasonic fingerprint recognition devices, and achieve high loop efficiency, The effect of improving the efficiency of ultrasonic reception and improving the efficiency of ultrasonic transmission

Active Publication Date: 2019-12-06
SILEAD
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the current scheme of an ultrasonic fingerprint recognition device using a single piezoelectric material tends to cause low loop efficiency (loop efficiency=transmitting efficiency×receiving efficiency), thereby restricting the recognition sensitivity of the ultrasonic fingerprint recognition device

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electronic equipment, ultrasonic fingerprint identification device and manufacturing method thereof
  • Electronic equipment, ultrasonic fingerprint identification device and manufacturing method thereof
  • Electronic equipment, ultrasonic fingerprint identification device and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0053] In order to enable those skilled in the art to better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described The embodiments are only some of the embodiments of the present application, but not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the scope of protection of this application.

[0054]Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the scope of protection of this application. For example, in the following description, forming the second component above the first component may include an embodiment in wh...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The embodiment of the present application provides an electronic device, an ultrasonic fingerprint identification device and a manufacturing method thereof, the method comprising: forming a first piezoelectric layer with a specific piezoelectric strain constant on the top of the base layer; forming a piezoelectric layer on the top of the first piezoelectric layer A first planar electrode; a second piezoelectric layer with a specific piezoelectric voltage constant is formed on top of the first planar electrode; a second planar electrode is formed on top of the second piezoelectric layer; a resonant cavity is formed on the base layer, and resonant A third planar electrode is formed in the cavity to form the first device; the first planar electrode, the second piezoelectric layer and the second planar electrode are used to realize ultrasonic emission; the third planar electrode, the first piezoelectric layer, and the second piezoelectric layer The electric layer and the second planar electrode are used to realize ultrasonic wave reception; the first device is integrated with a matching semiconductor device to form an ultrasonic fingerprint identification device. The embodiments of the present application can improve the circuit efficiency and identification sensitivity of the ultrasonic fingerprint identification device.

Description

technical field [0001] The present application relates to the technical field of ultrasonic fingerprint identification, in particular to an electronic device, an ultrasonic fingerprint identification device and a manufacturing method thereof. Background technique [0002] In the ultrasonic fingerprint identification technology, the main function of the ultrasonic fingerprint identification device is to convert the excitation signal into an ultrasonic wave and emit it in a direction perpendicular to the fingerprint, and at the same time receive the ultrasonic wave reflected by the fingerprint and convert it into a corresponding electrical signal. Therefore, the design of the ultrasonic fingerprint identification device is very critical. [0003] In the design of ultrasonic fingerprint identification device, the preparation of piezoelectric material is also a key point. The piezoelectric materials currently used are generally AlN, lead zirconate titanate piezoelectric ceramic...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G06K9/00G07C9/00H01L41/113H10N30/30
CPCG07C9/00563G06V40/1306H10N30/302
Inventor 不公告发明人
Owner SILEAD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products