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Manufacturability scoring method and apparatus for integrated circuit design, medium and device

An integrated circuit and manufacturability technology, applied in the field of manufacturability scoring of integrated circuit design, can solve problems such as evaluation failure

Inactive Publication Date: 2017-10-17
VAYO SHANGHAI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the number of problems found in the design of a simple circuit is the same as that of a complex circuit, it will be considered that the design level of the two circuits is exactly the same, which will directly lead to the failure of the evaluation.

Method used

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  • Manufacturability scoring method and apparatus for integrated circuit design, medium and device
  • Manufacturability scoring method and apparatus for integrated circuit design, medium and device
  • Manufacturability scoring method and apparatus for integrated circuit design, medium and device

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Embodiment Construction

[0034] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that, in the case of no conflict, the following embodiments and features in the embodiments can be combined with each other.

[0035] It should be noted that the diagrams provided in the following embodiments are only schematically illustrating the basic ideas of the present invention, and only the components related to the present invention are shown in the diagrams rather than the number, shape and shape of the compo...

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Abstract

The invention provides a manufacturability scoring method and apparatus for integrated circuit design, a medium and a device. The method comprises the steps of determining score relational expressions composed of circuit analysis main items, weight scores of the circuit analysis main items, circuit analysis sub-items and weight scores of the circuit analysis sub-items by designing a scoring rule; analyzing the manufacturability of the circuit analysis sub-items of a to-be-tested circuit to obtain analysis results of the circuit analysis sub-items; and correspondingly substituting the analysis results into the score relational expressions to perform calculation so as to obtain a manufacturability score of the to-be-tested circuit, and performing display. A relatively standard, universal and reasonable mechanism used for evaluating the manufacturability of the integrated circuit design is provided. In addition, the scoring method and apparatus not only can serve as an evaluation basis of design quality but also can be extensively applied to the scoring of multiple fields of reliability analysis, heat analysis, stress analysis and the like.

Description

technical field [0001] The invention relates to the field of manufacturability design of integrated circuits, in particular to a manufacturability scoring method, device, medium and equipment for integrated circuit design. Background technique [0002] Design for Manufacturability (Design for Manufacturing, DFM), which mainly studies the relationship between the physical characteristics of the product itself and the various parts of the manufacturing system, and uses it in product design to integrate the entire manufacturing system together. Overall optimization to make it more standardized in order to reduce costs, shorten production time, improve product manufacturability and work efficiency. [0003] Smart manufacturing needs to speak with data. However, at this stage, there is no scoring method similar to exam scores for manufacturability analysis and review after wiring, chip design and circuit principle design in the industry. The usual manufacturability analysis onl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
CPCG06F30/398G06F2119/18
Inventor 钱胜杰刘丰收朱忠良瞿永建刘继硕郄国亮武文静苏盼
Owner VAYO SHANGHAI TECH
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