3 results about "Design for manufacturability" patented technology

The present disclosure provides an antenna effect processing method, relates to the technical field of artificial intelligence, and particularly relates to the technical field of chip design, integrated circuit design and manufacturability design. The method comprises the following steps: based on the port correspondence relationship between a target module and an interaction module, determining an interaction port for a target port to be designed in the target module among ports included in the interaction module; based on an interaction metal layer required by a wire of the interaction port and a corresponding interaction layer area of the interaction metal layer, and an actual gate oxide layer area corresponding to the interaction port, determining an equivalent gate oxide layer area corresponding to the interaction metal layer; and based on the equivalent gate oxide layer area corresponding to the interaction metal layer, designing a target layer area used by a target metal layer corresponding to the interaction metal layer for wire of the target port. The present disclosure realizes accurate quantification and pre-constraint of cross-module interconnection antenna effect at the module level, shortens the design iteration period, and optimizes the chip area efficiency.

The invention relates to the technical field of high-density server design, and particularly provides a thermal design and electromagnetic compatibility cooperation method and system for a high-density server, and the method comprises the following steps: S1, defining an EMC-thermal coupling design normal form; s2, shielding effectiveness and temperature rise index parameters are determined, the size of a high-density server is determined, and position index parameters of electric devices in the server are checked; s3, factors influencing heat dissipation and electromagnetic compatibility are determined; s4, variance analysis ANOVA adopts an orthogonal test method to calculate an influence factor weight; s5, constructing a three-dimensional electromagnetic field model and a computational fluid dynamics (CFD) model; and S6, exporting multi-physical coupling simulation result data, performing manufacturability design verification, discriminating non-machinable parameters, and assigning machinable parameter values near the non-machinable parameters. Compared with the prior art, the method can reduce the trial production frequency, improve the failure prevention identification degree, reduce the research and development period through the full-process collaborative design, accelerate the research and development progress and reduce the research and development cost.

Systems and methods for using a design for manufacturing (DFM) structure to detect an overlay shift. The DFM structure comprises four branches with transistors and switches connected to a switch control. The first branch measures a current-voltage characteristic corresponding to the overlay shift in a first direction using a first switch. A second branch measures the current-voltage characteristic corresponding to the overlay shift in a second direction using a second switch. A third branch measures the current-voltage characteristic corresponding to the overlay shift in a third direction using a third switch. A fourth branch measures the current-voltage characteristic corresponding to the overlay shift in a fourth direction using a fourth switch. The switches are connected to a switch control configured to active each of the switches to measure the current-voltage characteristic, such that the value of the current-voltage characteristic indicates an overlay shift in an integrated circuit of a die.