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1 results about "Design for manufacturability" patented technology

Design for manufacturability (also sometimes known as design for manufacturing or DFM) is the general engineering practice of designing products in such a way that they are easy to manufacture. The concept exists in almost all engineering disciplines, but the implementation differs widely depending on the manufacturing technology. DFM describes the process of designing or engineering a product in order to facilitate the manufacturing process in order to reduce its manufacturing costs. DFM will allow potential problems to be fixed in the design phase which is the least expensive place to address them. Other factors may affect the manufacturability such as the type of raw material, the form of the raw material, dimensional tolerances, and secondary processing such as finishing.

Antenna effect processing method and apparatus, electronic device, medium, and product

PendingCN122452496AAntenna effectInterconnection
The present disclosure provides an antenna effect processing method, relates to the technical field of artificial intelligence, and particularly relates to the technical field of chip design, integrated circuit design and manufacturability design. The method comprises the following steps: based on the port correspondence relationship between a target module and an interaction module, determining an interaction port for a target port to be designed in the target module among ports included in the interaction module; based on an interaction metal layer required by a wire of the interaction port and a corresponding interaction layer area of the interaction metal layer, and an actual gate oxide layer area corresponding to the interaction port, determining an equivalent gate oxide layer area corresponding to the interaction metal layer; and based on the equivalent gate oxide layer area corresponding to the interaction metal layer, designing a target layer area used by a target metal layer corresponding to the interaction metal layer for wire of the target port. The present disclosure realizes accurate quantification and pre-constraint of cross-module interconnection antenna effect at the module level, shortens the design iteration period, and optimizes the chip area efficiency.
Owner:KUNWANG (SHANGHAI) TECH CO LTD