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Cover plate assembly, cover plate assembly machining method and electronic equipment

A processing method and component technology, which are applied in the direction of household components, cabinets/boxes/drawer parts, household appliances, etc., can solve the problems of poor bonding quality of plastic rings and glass cover plates, affecting the appearance, etc., and improve the appearance. The effect of quality and sealing performance

Inactive Publication Date: 2017-10-24
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Application Information

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Problems solved by technology

However, in traditional electronic devices, the bonding quality of the plastic ring and the glass cover is poor, which also affects the appearance

Method used

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  • Cover plate assembly, cover plate assembly machining method and electronic equipment
  • Cover plate assembly, cover plate assembly machining method and electronic equipment
  • Cover plate assembly, cover plate assembly machining method and electronic equipment

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Embodiment Construction

[0030] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0031] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "inner", "outer", "left", "right" and similar expressions are used herein for the purpose of descripti...

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Abstract

The invention relates to a cover plate assembly, a cover plate assembly machining method and electronic equipment comprising the cover plate assembly. The cover plate assembly machining method comprises the following steps that discharging is conducted, and cover plate glass is provided; primer is applied, and a primer layer is formed on the cover plate glass in a dispensing and silk screening or pasting manner; injection molding is conducted, the cover plate glass on which the primer layer is formed is placed in an injection molding die, and a plastic part is formed on the edge of the cover plate glass in an injection molding manner; and material taking is conducted, and the cover plate glass connected with the glass part is taken out of the injection molding die. The cover plate assembly comprises the cover plate glass, the plastic part and the primer layer, wherein the plastic part surrounds the cover plate glass and is in seamless connection with the cover plate glass, and the primer layer is arranged between the plastic part and the cover plate glass. Through the action of the primer layer, the connecting strength between the plastic part and the cover plate glass is enhanced, the plastic part and the cover plate glass are in seamless connection, and the appearance quality and sealing performance of the cover plate assembly are improved.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a cover assembly, electronic equipment including the cover assembly, and a processing method for the cover assembly. Background technique [0002] In electronic equipment such as mobile phones, a plastic ring is placed between the glass cover and the casing. The plastic ring has good impact resistance and can effectively absorb the impact energy between the glass cover and the casing, which can absorb shock and prevent shattering. At the same time, it can also achieve the effect of sealing and decoration. However, in conventional electronic devices, the bonding quality of the plastic ring and the glass cover is poor, which also affects the appearance. Contents of the invention [0003] A technical problem solved by the invention is how to eliminate the gap existing on the cover plate assembly. [0004] A method for processing a cover plate assembly, comprising the st...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C45/14B29C45/77B29C45/78B29C45/72B29C45/73H05K5/03B29L31/34
CPCB29C45/14336B29C45/14778B29C45/7207B29C45/73B29C45/77B29C45/78B29C2045/1486B29C2045/14868B29L2031/3406H05K5/03
Inventor 成蛟
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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