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A kind of LED chip and its manufacturing method

A technology of LED chip and manufacturing method, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of complicated LED chip manufacturing process and high LED chip cost, and achieve the effects of reducing the number of photolithography processes, simplifying the process, and reducing costs

Active Publication Date: 2019-06-04
XIAMEN CHANGELIGHT CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Currently, in the process of manufacturing LED chips, many times of photolithography are used, which makes the manufacturing process of LED chips complicated and makes the cost of LED chips higher.

Method used

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  • A kind of LED chip and its manufacturing method
  • A kind of LED chip and its manufacturing method
  • A kind of LED chip and its manufacturing method

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Embodiment Construction

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0029] As mentioned in the background, with the continuous development of the industry and continuous innovation of technology, the application of light-emitting diodes is becoming more and more extensive. Light-emitting diode is a semiconductor device that uses energy released by carrier recombination to form light. LED chips have many advantages such as low power consumption, pure chromaticity, long life, small size, fast response time, energy saving and envi...

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Abstract

The invention discloses an LED (Light Emitting Diode) chip and a production method thereof. When a through hole and a step area are formed, the through hole and the step area can be formed through one photolithographic process, so that the number of times of the photolithographic process is effectively reduced, thus the number of times of the photolithographic process is reduced through an innovative preparation method, so as to achieve the purposes of simplifying the process of making the LED chip, and reducing the cost of the LED chip.

Description

technical field [0001] The present invention relates to the technical field of LED (Light Emitting Diode, light-emitting diode) chips, and more specifically, relates to an LED chip and a manufacturing method thereof. Background technique [0002] With the continuous development of the industry and the continuous innovation of technology, the application of light-emitting diodes is becoming more and more extensive. Light-emitting diode is a semiconductor device that uses energy released by carrier recombination to form light. LED chips have many advantages such as low power consumption, pure chromaticity, long life, small size, fast response time, energy saving and environmental protection. In recent years, with the continuous deepening of research on LED chips, the luminous efficiency of LED chips has been greatly improved, and has been widely used in various fields of display and lighting. Currently, in the process of manufacturing the LED chip, many photolithography proce...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00H01L33/14H01L33/20
CPCH01L33/005H01L33/0075H01L33/145H01L33/20
Inventor 邬新根李俊贤吴奇隆汪洋陈凯轩刘英策魏振东周弘毅蔡立鹤黄新茂蔡和勋李耿诚
Owner XIAMEN CHANGELIGHT CO LTD