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Polyimide film and copper clad laminate

A technology of polyimide film and polyimide layer, which is applied in the direction of layered products, metal layered products, synthetic resin layered products, etc., and can solve the problem of dimensional stability of copper-clad laminates without any consideration , to achieve the effects of excellent dimensional stability, low dimensional change rate and excellent production stability

Active Publication Date: 2021-09-21
NIPPON STEEL CHEM &MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the above-mentioned Patent Document 1 and Patent Document 2, no consideration is given to the dimensional stability of the copper-clad laminate.

Method used

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  • Polyimide film and copper clad laminate
  • Polyimide film and copper clad laminate
  • Polyimide film and copper clad laminate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0217] Hereinafter, an Example is shown and the characteristics of this invention are demonstrated more concretely. However, the scope of the present invention is not limited to the examples. In addition, in the following examples, unless otherwise specified, various measurements and evaluations were performed by the following methods.

[0218] [Measurement of viscosity]

[0219] Regarding the measurement of the viscosity, the viscosity at 25° C. was measured using an E-type viscometer (manufactured by Brookfield, trade name: DV-II+Pro). The rotational speed was set so that the torque (torque) became 10% to 90%, and after 2 minutes from the start of the measurement, the value when the viscosity was stable was read.

[0220] [Measurement of weight average molecular weight]

[0221] The weight average molecular weight was measured by gel permeation chromatography (manufactured by Tosoh Co., Ltd., trade name: HLC-8220GPC). Polystyrene was used as a standard substanc...

Synthetic example 1

[0248] Under a nitrogen flow, 1146.4 parts by weight of m-TB (5.4 parts by mole) and TPE-R (0.6 parts by mole) of 175.4 parts by weight and DMAc in an amount of 15% by weight after polymerization were charged into the reaction tank, Stir at room temperature to dissolve. Then, after adding 706.1 parts by weight of BPDA (2.4 parts by mole) and 965.4 parts by weight of NTCDA (3.6 parts by mole), stirring was continued at room temperature for 3 hours to perform a polymerization reaction to obtain a polyamic acid solution 1 . The solution viscosity of the polyamic acid solution 1 was 41,100 cps.

[0249] Then, the polyamic-acid solution 1 was uniformly apply|coated on the support base material made of stainless steel so that the thickness after hardening might become about 25 micrometers, and it heat-dried at 120 degreeC, and removed the solvent. Furthermore, staged heat treatment is carried out within 30 minutes from 120°C to 360°C to complete imidization and prepare polyimid...

Synthetic example 2

[0251] Under a nitrogen flow, 743.0 parts by weight of m-TB (3.5 parts by mole) and 672.4 parts by weight of TPE-R (2.3 parts by mole) and DMAc in an amount of 15% by weight of the solid concentration after polymerization were charged into the reaction tank, Stir at room temperature to dissolve. Then, after adding 353.1 parts by weight of BPDA (1.2 parts by mole) and 1233.6 parts by weight of NTCDA (4.6 parts by mole), stirring was continued at room temperature for 3 hours to carry out polymerization reaction, and polyamic acid solution 2 was obtained. The solution viscosity of the polyamic acid solution 2 was 41,900 cps.

[0252] Then, the polyamic-acid solution 2 was uniformly apply|coated on the support base material made of stainless steel so that the thickness after hardening might become about 25 micrometers, and it heat-dried at 120 degreeC, and removed the solvent. Furthermore, staged heat treatment is carried out within 30 minutes from 120°C to 360°C to complete ...

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Abstract

The present invention provides a polyimide film capable of reducing dimensional changes during high-temperature processing and a copper-clad laminate using the polyimide film. The polyimide film of the present invention has a thermoplastic polyimide layer on at least one side of the non-thermoplastic polyimide layer, and satisfies: (i) the thermal expansion coefficient is in the range of 10ppm / K~30ppm / K; (ii) ) The glass transition temperature of the thermoplastic polyimide is within the range of 200°C to 350°C; (iii) the in-plane retardation (RO) value is within the range of 5nm to 50nm; (iv) the width direction (TD Direction) RO heterogeneity (ΔRO) is 10nm or less.

Description

technical field [0001] The invention relates to a polyimide film and a copper-clad laminate. Background technique [0002] In recent years, with the development of miniaturization, weight reduction, and space saving of electronic equipment, flexible printed wiring boards (Flexible Printed Circuits, FPC) that are thin, lightweight, flexible, and have excellent durability even after repeated bending needs are constantly increasing. FPC can realize three-dimensional and high-density installation even in a limited space, so its use has been continuously expanded to include electronic devices such as hard disk drives (Hard Disk Drive, HDD), digital versatile discs (Digital Versatile Disc, DVD), and mobile phones. Wiring or cable (cable), connector (connector) and other parts of the moving part. [0003] The FPC is manufactured by etching a copper layer of a copper-clad laminate (CCL) for wiring processing. For FPCs that are continuously bent or bent 180° in mobile phones or sm...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L79/08C08J5/18C08G73/10B32B27/28B32B27/06B32B15/20B32B15/08
CPCC08G73/1071C08J5/18B32B15/08B32B15/20B32B27/281C08J2379/08B32B2307/734B32B2457/00B32B27/08B32B2311/12B32B2307/206
Inventor 松下祐之金子和明须藤芳树
Owner NIPPON STEEL CHEM &MATERIAL CO LTD
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