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Polyimide film and copper-clad laminate

一种聚酰亚胺膜、聚酰亚胺层的技术，应用在分层产品、金属层状产品、合成树脂层状产品等方向，能够解决覆铜层叠板尺寸稳定性未作任何考虑等问题，达到尺寸稳定性优异、尺寸变化率低、生产稳定性优异的效果

Pending Publication Date: 2021-10-22
NIPPON STEEL CHEM &MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the above-mentioned Patent Document 1 and Patent Document 2, no consideration is given to the dimensional stability of the copper-clad laminate.

Method used

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  • Polyimide film and copper-clad laminate
  • Polyimide film and copper-clad laminate
  • Polyimide film and copper-clad laminate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0218] Hereinafter, an Example is shown and the characteristics of this invention are demonstrated more concretely. However, the scope of the present invention is not limited to the examples. In addition, in the following examples, unless otherwise specified, various measurements and evaluations were performed by the following methods.

[0219] [Measurement of viscosity]

[0220] Regarding the measurement of the viscosity, the viscosity at 25° C. was measured using an E-type viscometer (manufactured by Brookfield, trade name: DV-II+Pro). The rotational speed was set so that the torque (torque) became 10% to 90%, and after 2 minutes from the start of the measurement, the value when the viscosity was stable was read.

[0221] [Measurement of weight average molecular weight]

[0222] The weight average molecular weight was measured by gel permeation chromatography (manufactured by Tosoh Co., Ltd., trade name: HLC-8220GPC). Polystyrene was used as a standard substance, and N,N...

Synthetic example 1

[0249] Under a nitrogen flow, 1146.4 parts by weight of m-TB (5.4 parts by mole) and TPE-R (0.6 parts by mole) of 175.4 parts by weight and DMAc in an amount of 15% by weight after polymerization were charged into the reaction tank, Stir at room temperature to dissolve. Then, after adding 706.1 parts by weight of BPDA (2.4 parts by mole) and 965.4 parts by weight of NTCDA (3.6 parts by mole), stirring was continued at room temperature for 3 hours to perform a polymerization reaction to obtain a polyamic acid solution 1 . The solution viscosity of the polyamic acid solution 1 was 41,100 cps.

[0250] Then, the polyamic-acid solution 1 was uniformly apply|coated on the support base material made of stainless steel so that the thickness after hardening might become about 25 micrometers, and it heat-dried at 120 degreeC, and removed the solvent. Furthermore, staged heat treatment is carried out within 30 minutes from 120°C to 360°C to complete imidization and prepare polyimide fi...

Synthetic example 2

[0252] Under a nitrogen flow, 743.0 parts by weight of m-TB (3.5 parts by mole) and 672.4 parts by weight of TPE-R (2.3 parts by mole) and DMAc in an amount of 15% by weight of the solid concentration after polymerization were charged into the reaction tank, Stir at room temperature to dissolve. Then, after adding 353.1 parts by weight of BPDA (1.2 parts by mole) and 1233.6 parts by weight of NTCDA (4.6 parts by mole), stirring was continued at room temperature for 3 hours to carry out polymerization reaction, and polyamic acid solution 2 was obtained. The solution viscosity of the polyamic acid solution 2 was 41,900 cps.

[0253] Then, the polyamic-acid solution 2 was uniformly apply|coated on the support base material made of stainless steel so that the thickness after hardening might become about 25 micrometers, and it heat-dried at 120 degreeC, and removed the solvent. Furthermore, staged heat treatment is carried out within 30 minutes from 120°C to 360°C to complete imid...

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Abstract

The invention provides a polyimide film capable of reducing a dimensional change at the time of high-temperature processing and a copper-clad laminate using the same. The polyimide film has a thermoplastic polyimide layer on at least one side of a non-thermoplastic polyimide layer, and satisfies the following conditions: (i) a thermal expansion coefficient is in the range of 10 to 30 ppm / K; (ii) glass transition temperature of a thermoplastic polyimide is within the range of 200 to 350 DEG C; (iii) a value of in-plane retardation (RO) is in the range of 5 to 50 nm; (iv) the deviation of the RO ([Delta]RO) in the width direction (TD direction) is 10 nm or less.

Description

[0001] This invention is a divisional application of the invention patent application with the application number 201710279853.7 and the invention name "polyimide film and copper-clad laminate" filed on April 25, 2017. technical field [0002] The invention relates to a polyimide film and a copper-clad laminate. Background technique [0003] In recent years, with the development of miniaturization, weight reduction, and space saving of electronic equipment, flexible printed wiring boards (Flexible Printed Circuits, FPC) that are thin, lightweight, flexible, and have excellent durability even after repeated bending needs are constantly increasing. FPC can realize three-dimensional and high-density installation even in a limited space, so its use has been continuously expanded to include electronic devices such as hard disk drives (Hard Disk Drive, HDD), digital versatile discs (Digital Versatile Disc, DVD), and mobile phones. Wiring or cable (cable), connector (connector) an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08J5/18C08G73/10B32B27/28B32B27/06B32B15/20B32B15/08
CPCC08G73/1071C08J5/18B32B15/08B32B15/20B32B27/281C08J2379/08B32B2307/734B32B2457/00B32B27/08B32B2311/12B32B2307/206
Inventor 松下祐之金子和明须藤芳树
Owner NIPPON STEEL CHEM &MATERIAL CO LTD
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