Efficient heat dissipation device for computer mainframe structure
A heat dissipation device and computer technology, applied in the field of computers, can solve the problems of poor heat dissipation effect of computer mainframes, and achieve the effect of ensuring service life and good heat dissipation effect
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[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0022] see Figure 1-3 , the present invention provides a technical solution:
[0023] A high-efficiency heat dissipation device for a computer mainframe structure, comprising a box body 1, an air inlet bucket 13 is provided at the bottom of the left side of the inner wall of the box body 1, and a dustproof cloth 14 is fixedly connected to the surface of the air inlet bucket 13, and the air inlet bucket The air outlet of 13 communicates with the inner wall of...
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