Efficient heat dissipation device for computer mainframe structure

A heat dissipation device and computer technology, applied in the field of computers, can solve the problems of poor heat dissipation effect of computer mainframes, and achieve the effect of ensuring service life and good heat dissipation effect

Inactive Publication Date: 2017-11-03
合肥雷呈信息技术有限公司
View PDF3 Cites 11 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the deficiencies of the prior art, the present invention provides a high-efficiency heat dissipation

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Efficient heat dissipation device for computer mainframe structure
  • Efficient heat dissipation device for computer mainframe structure
  • Efficient heat dissipation device for computer mainframe structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0022] see Figure 1-3 , the present invention provides a technical solution:

[0023] A high-efficiency heat dissipation device for a computer mainframe structure, comprising a box body 1, an air inlet bucket 13 is provided at the bottom of the left side of the inner wall of the box body 1, and a dustproof cloth 14 is fixedly connected to the surface of the air inlet bucket 13, and the air inlet bucket The air outlet of 13 communicates with the inner wall of...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses an efficient heat dissipation device for a computer mainframe structure. The device comprises a box body, a partition board is fixedly connected to the portion between the bottoms of two sides of the inner wall of the box body, and an exhaust fan, a water tank, a drying oven and a motor are fixedly connected to the bottom of the inner wall of the box body from left to right in sequence; a first bevel gear is arranged on the output shaft of the motor in a sleeving mode, a first rotating rod is rotatably connected to the right side of the bottom of the inner wall of the box body through a bearing, and a second bevel gear is arranged on the surface of the first rotating rod in a sleeving mode; the surface of the second bevel gear is meshed with that of the first bevel gear. The invention relates to the technical field of computers. According to the efficient heat dissipation device for the computer mainframe structure, continuous rotation, air jetting and cooling are conducted on a computer mainboard, the aim that a computer mainframe is subjected to all-sided cooling is achieved, it is guaranteed that the computer mainboard cannot cause abnormal use of the computer due to the overheating mainboard caused by incomplete cooling, and the actual service life of the computer mainboard is guaranteed.

Description

technical field [0001] The invention relates to the technical field of computers, in particular to a high-efficiency heat dissipation device for computer host structures. Background technique [0002] The host computer refers to the main body part of the computer except the input and output devices, and it is also the control box for placing the motherboard and other main components, usually including CPU, memory, hard disk, optical drive, power supply, and other input and output controllers and interfaces, such as USB controllers, graphics cards, network cards, sound cards, etc. Those located in the main box are usually called internal devices, while those located outside the main box are usually called peripherals (such as monitors, keyboards, mice, external hard disks, external optical drives, etc.), usually, the host itself (after installing the software) has been It is a computer system that can operate independently. A computer with a special purpose such as a server ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): G06F1/20
Inventor 汪海文
Owner 合肥雷呈信息技术有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap