Encapsulation cover plate, organic light-emitting display and preparation method thereof
A technology of organic light-emitting devices and packaging cover plates, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electric solid-state devices, etc., and can solve problems such as erosion, reduced stability of organic light-emitting displays, and reduced luminous quantum efficiency of organic light-emitting displays. , to achieve the effects of prolonging service life, good packaging effect and reducing damage
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[0041] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of patent protection of the present invention.
[0042] like figure 1 , figure 2 as well as image 3 As shown, the present invention provides a package cover plate, comprising:
[0043] The cover plate body 1, the cover plate body 1 is provided with an opening groove 2 for passing in dry gas;
[0044] A cover plug 3 for covering the openings at both ends of the open slot 2;
[0045] At least the water-absorbing layer 4 covering the mouth of the open groove 2 .
[0046] The packaging cover pla...
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