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Bottom plate for thin plate dense resin plugging and making method thereof

A resin plug hole and bottom plate technology, which is used in the manufacture of printed circuits, the formation of electrical connection of printed components, and electrical components, can solve the problems of easy bending of circuit boards, poor quality of plug holes, and large hollow area to ensure flatness. , the effect of reducing the quantity and reducing the scrap rate

Pending Publication Date: 2017-11-21
DALIAN CHONGDA CIRCUIT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Usually, there are through air guide holes 01 corresponding to the holes to be plugged in the printed circuit board on the bottom plate, such as figure 1 As shown, since the distance between the air guide holes 01 is very small, the air guide holes 01 are connected together, resulting in too large hollow area, and the supporting force of the middle area 02 surrounded by the air guide holes 01 becomes very weak. For thinner sheets, the circuit board is more prone to bending during the plugging process, resulting in poor plugging quality

Method used

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  • Bottom plate for thin plate dense resin plugging and making method thereof
  • Bottom plate for thin plate dense resin plugging and making method thereof
  • Bottom plate for thin plate dense resin plugging and making method thereof

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Embodiment 1

[0031] see figure 2 , figure 2 It is a structural schematic diagram of the bottom plate used for dense resin plug holes in thin plates in this embodiment. As shown in the figure, a bottom plate for thin plate dense resin plug holes includes an unhollowed air guide groove 101, the air guide groove 101 corresponds to the thin plate dense resin plug hole pattern, and hollowed out air guide holes are appropriately added in the air guide groove 101 102.

[0032] The shape of the air guide groove 101 is a closed rectangle, and the air guide holes 102 are drilled at the four corners of the closed rectangular air guide groove 01 and the center points of the four sides of the rectangle, and there is a certain distance between adjacent air guide holes, so that The bottom plate still has sufficient supporting force and is not easily deformed, so that the circuit board on it is not deformed during the plugging process, has high flatness, and improves the quality of the plugging hole. ...

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Abstract

The invention discloses a bottom plate for dense resin plug holes in a thin plate and a manufacturing method. The bottom plate of the invention includes an air guide groove that is not hollowed out, and the air guide groove corresponds to the pattern of dense resin plug holes in a thin plate. Increase the hollow air guide hole. By combining the air guide groove and the air guide hole, not only the air guide function is ensured, but also the supporting force of the bottom plate is improved, and the quality of the plug hole is improved.

Description

technical field [0001] The invention relates to the field of printed circuit board manufacture, and more particularly relates to a bottom plate for dense resin plugging holes in a thin plate and a manufacturing method thereof. Background technique [0002] With the development of miniaturization of electronic devices, the wiring area and pattern design area of ​​PCB are also continuously reduced. The resin plugging process is a technical method invented by people to reduce the design size of PCB and cooperate with the development of electronic devices. The resin plugging process is especially suitable for high-density, high-integration circuit manufacturing. [0003] The resin plugging process is mainly used in the plugging of inner holes, inner layer buried holes and through holes. The advantages of the technology are to reduce the distance between holes and increase the wiring density. [0004] The earlier resin plugging process is to place the circuit board directly on ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/40
CPCH05K3/0094H05K3/40H05K2201/0959
Inventor 陈志强
Owner DALIAN CHONGDA CIRCUIT
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