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Dummy head assembly

A technology of false pressure and components, which is applied in the direction of instruments, nonlinear optics, optics, etc., can solve the problems of cumbersome workflow and achieve the effect of simplifying the process and reducing the cost

Inactive Publication Date: 2020-06-05
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the prior art, the adsorption length of the dummy indenter is fixed. When the length of the flexible circuit board changes, the dummy indenter needs to be replaced according to the length of the flexible circuit board, which leads to cumbersome work process.

Method used

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  • Dummy head assembly
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Examples

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Embodiment Construction

[0032] Example embodiments will now be described more fully with reference to the accompanying drawings. Exemplary embodiments may, however, be embodied in many forms and should not be construed as limited to the examples set forth herein; rather, these examples are provided so that this disclosure will be thorough and complete and will fully convey the concept of the exemplary embodiments communicated to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed descriptions will be omitted.

[0033] Although relative terms such as "upper" and "lower" are used in this specification to describe the relative relationship of one component of an icon to another component, these terms are used in this specification only for convenience, for example, according to the description in the accompanying drawings directions for the example described above. It will be appreciated that if the illustrated device is ...

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PUM

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Abstract

The invention relates to the field of circuit connection, and provides a fake pressure head assembly. The fake pressure head assembly comprises a fake pressure head body and an adjusting rod, and a negative-pressure cavity, a flow dividing cavity and through holes are formed in the fake pressure head body, wherein the flow dividing cavity is communicated with the negative-pressure cavity, and the through holes are distributed along the flow dividing cavity and the negative-pressure cavity. One end of each through hole is communicated with the negative-pressure cavity or the flow dividing cavity, the other end of each through hole extends to the first surface of the fake pressure head body, and the first end of the adjusting rod is located in the flow dividing cavity and makes sealed contact with the flow dividing cavity. In the fake pressure head assembly, the number of the through hole communicated with the negative-pressure cavity can be changed by adjusting the depth at which the first end of the adjusting rod extends into the flow dividing cavity, the adsorption length of the fake pressure head can be changed, and then the fake pressure head assembly can be used for adsorbing flexible printed circuit boards different in length.

Description

technical field [0001] The invention relates to the technical field of circuit connection, in particular to a dummy indenter assembly. Background technique [0002] Dummy indenter components are used in many fields, mainly for pre-positioning of circuit boards; taking LCD module technology as an example, in the current LCD module technology and OLB (Out Lead Bonding) process, dummy indenters are required The head assembly absorbs the flexible circuit board for false pressing, so that the pins on the flexible circuit board and the display surface can be pre-positioned. [0003] In the prior art, the dummy indenter assembly includes a negative pressure chamber and a through hole arranged in the dummy indenter body, one opening of the through hole communicates with the negative pressure chamber, and the other opening of the through hole is located on the designated surface of the dummy indenter body. The surface is connected to the flexible circuit board. Through the negative...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02F1/13
CPCG02F1/1303
Inventor 吴方应方飞陈亮陆晓明马冰冰范荣坤
Owner BOE TECH GRP CO LTD