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Manufacturing method of flexible substrate, flexible substrate and flexible display panel

A manufacturing method and technology for flexible substrates, which are applied in chemical instruments and methods, semiconductor/solid-state device manufacturing, gaseous chemical plating, etc., can solve problems such as poor interface adhesion, stress matching, and poor foreign matter, so as to avoid stress matching and foreign matter. Defective, improved surface wettability, cost-saving effect

Active Publication Date: 2017-11-24
BOE TECH GRP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In related technologies, flexible display substrates prepared based on PI need to improve the properties of the first PI layer such as water barrier, oxygen barrier, and scratch resistance by depositing a barrier inorganic layer. Problems such as poor interface adhesion between layers
In the related art, the above-mentioned problem of poor interface adhesion is improved by depositing an interface inorganic layer, but problems such as stress matching and foreign matter are derived from this.

Method used

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  • Manufacturing method of flexible substrate, flexible substrate and flexible display panel
  • Manufacturing method of flexible substrate, flexible substrate and flexible display panel
  • Manufacturing method of flexible substrate, flexible substrate and flexible display panel

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Embodiment Construction

[0038] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concept of example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0039] Furthermore, the drawings are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and thus repeated descriptions thereof will be omitted.

[0040] This exemplary embodiment firstly provides a method for manufacturing a flexible substrate, which can be used to prepare a flexible substrate, such as a polyimide flexible...

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Abstract

The invention belongs to the field of display panels, and specifically relates to a manufacturing method of a flexible substrate, the flexible substrate and a flexible display panel. The manufacturing method comprises: providing a glass substrate, and forming a first flexible material layer on the surface of the glass substrate; depositing a barrier inorganic layer on the surface of the first flexible material layer, wherein the barrier inorganic layer comprises at least one of a silicon oxide material layer and a silicon nitride material layer; when the barrier inorganic layer is deposited, performing plasma bombardment on the surface of the barrier inorganic layer to improve the wettability of the surface of the barrier inorganic layer; forming a second flexible material layer on the surface of the barrier inorganic layer, and peeling the glass substrate. The method can ensure that the second flexible material layer is well attached to the barrier inorganic layer to form a film, does not need to additionally deposit an interface inorganic layer to solve the problems of poor interface attachment and the like, and is simple and low in cost.

Description

technical field [0001] The present disclosure relates to the technical field of display panels, and in particular to a method for manufacturing a flexible substrate, a flexible substrate prepared by the method, and a flexible display panel including the flexible substrate. Background technique [0002] With the development of science and technology and the progress of society, various display devices have been widely used in daily life. On the basis of the extensive use of these display devices, ultra-thin flexible display devices similar to paper are considered to be the next generation of display devices because they can be bent and have good portability. [0003] At present, the market has higher and higher requirements for ultra-thin flexible display products. In order to meet product requirements, more display devices will use flexible materials such as plastics and metals to make display substrates. For example, polyimide PI (Polymide) material is widely used due to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683H01L27/12
CPCH01L21/6835H01L27/1218H01L2221/68345B32B17/10018C23C16/01C23C16/402C23C16/345C23C16/50C03C17/3405C03C17/2453C23C16/401
Inventor 谢昌翰
Owner BOE TECH GRP CO LTD
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