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Ultraviolet light-emitting diode packaging structure

A technology for light-emitting diodes and packaging structures, applied in electrical components, electrical solid-state devices, circuits, etc., can solve problems such as damage to the sealing structure of the packaging structure, decrease in chip life, deterioration, etc., and achieve longer-term protection, better protection, and prolongation The effect of service life

Inactive Publication Date: 2017-12-01
UNISTARS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, colloid must still be used as a bonding agent between the glass and the substrate. After long-term use, the colloid at the joint also has the risk of deterioration, resulting in damage to the adhesion of the packaging structure, resulting in a significant decrease in the life of the chip, and also unable to provide long-term good performance of UV LEDs. Encapsulation effect

Method used

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  • Ultraviolet light-emitting diode packaging structure
  • Ultraviolet light-emitting diode packaging structure
  • Ultraviolet light-emitting diode packaging structure

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Embodiment Construction

[0057] The present invention provides a packaging structure for ultraviolet light emitting diodes (UV LEDs), which is used to solve the deterioration caused by existing packaging methods, and to improve the protection of UV LEDs with wavelengths below 450nm after long-term use. Effectively prolong the service life of UV LED. In order to make the above and other objects, features and advantages of the present invention more comprehensible, the following examples are used in conjunction with the accompanying drawings to describe in detail.

[0058] Figure 1A and Figure 1B Shown is a packaging structure 10 of an ultraviolet light emitting diode according to an embodiment of the present invention, wherein Figure 1A is a schematic cross-sectional structure diagram of the package structure 10, Figure 1B It is a schematic diagram of the top view structure. The packaging structure 10 provided in this embodiment is used for LEDs that generally do not have a concave cup structure ...

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Abstract

The present invention provides a packaging structure of ultraviolet light-emitting diodes, comprising: a substrate having an electrode; a chip disposed on the substrate and electrically connected to the electrode; a transparent cap covering the substrate and the chip; an adhesive layer disposed between the substrate and the transparent cap; and a light reflective layer disposed between the adhesion layer and the transparent cap, wherein the transparent cap is fixed onto the substrate via the light reflective layer and the adhesion layer.

Description

technical field [0001] The invention relates to a packaging structure of a light emitting diode, in particular to a packaging structure of an ultraviolet light emitting diode. Background technique [0002] Light emitting diode (light emitting diode, LED) is a semiconductor electronic component that can emit light, and has the advantages of energy saving, power saving, high efficiency, fast response time, long life cycle time, and does not contain mercury, and has environmental protection benefits. Has been widely used in lighting. Generally, LED packaging requires not only protection of LED chips, but also special requirements on materials such as light transmission, packaging methods and structures. [0003] In general packaging technology, an opaque patterned substrate is used to carry LED chips (chips) and electrodes, and after the LED chips and electrodes are electrically connected through metal wires, the entire chip, metal wires and opaque materials are covered with t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/60
CPCH01L33/483H01L33/60H01L33/486H01L33/58H01L2224/48091H01L2224/48227H01L2224/49175H01L2924/00014
Inventor 吴上义谢新贤
Owner UNISTARS