Packaging method for ultraviolet light emitting diode

Abstract

The invention provides a packaging method for ultraviolet light emitting diode, comprising: (S1) providing a carrier, connected to an electrode; (S2) fixing an UV LED chip on the carrier and electrically connecting the UV LED chip to the electrodes; (S3) covering the UV LED chip with transparent silicon-and-oxygen-containing solution; and (S4) performing a thermal curing process.

Description

technical field [0001] The invention relates to a packaging method of a light-emitting diode, in particular to a packaging method of an ultraviolet light-emitting diode. Background technique [0002] Light emitting diode (light emitting diode, LED) is a semiconductor electronic component that can emit light, and has the advantages of energy saving, power saving, high efficiency, fast response time, long life cycle time, and does not contain mercury, and has environmental protection benefits. Has been widely used in lighting. Generally, LED packaging requires not only protection of LED chips, but also special requirements on materials such as light transmission, packaging methods and structures. [0003] In general packaging technology, an opaque patterned substrate is used to carry LED chips (chips) and electrodes, and after the LED chips and electrodes are electrically connected through metal wires, the entire chip, metal wires, and electrodes are covered with transparent ...

AI Technical Summary

Problems solved by technology

[0004] Epoxy resin has the advantages of low cost, easy processing and good protection after packaging, so it is widely used in LED packaging, but the thermal stability of epoxy resin is insufficient, and the material properties after hardening are too hard, so it is not suitable Packaging for high power LED chips

Although pure siloxane materials have the advantages of good photothermal stability, easy processing, and good protection after packaging, they cannot be used in the packaging of short-wavelength light sources, such as ordinary ultraviolet light (wavelength less than 420nm), especially LED packages with wavelength below 365nm

Because the benzene ring contained in the pure siloxane material is easy to cause aging and cracking of the material under the irradiation of a short-wavelength light source, resulting in brittle cracks and other deterioration conditions, losing the protection characteristics of the LED chip, resulting in the LED chip being still usable. However, due to the poor protection of the packaging structure, the LED chip is damaged, thereby shortening the service life of the LED component

[0005] Therefore, how to improve the packaging structure for the ultraviolet light chip, avoiding the deterioration of the material and causing the decline of protection, etc., has become the subject of the present invention.

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