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Radiator structure applied to LED lamps

A technology of LED lamps and LED lamp beads, which is applied to semiconductor devices of light-emitting elements, cooling/heating devices of lighting devices, lighting and heating equipment, etc. Advanced problems, to achieve the effect of ensuring thermal conductivity and reducing weight

Inactive Publication Date: 2017-12-08
林杨
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The traditional LED lamp structure includes LED lamp beads, circuit boards, bases, radiators, etc.; LED lamp beads are installed on the circuit board, and heat transfer and heat dissipation are carried out between the circuit board and the base through thermal silica gel, and the base is generally attached to the base. Closed on the radiator, the heat is dissipated through the radiator; in order to ensure sufficient heat dissipation area, the volume of the radiator is generally made relatively large, and the part where the radiator contacts the base is usually made of solid material for heat conduction; Fins for heat dissipation are arranged around the solid material; although the thermal conductivity of this solid structure is higher than that of a hollow structure radiator; but this kind of lamp is relatively heavy and requires high strength for the installation position; The amount of raw materials used in the radiator is relatively large, resulting in high material costs for the radiator

Method used

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  • Radiator structure applied to LED lamps
  • Radiator structure applied to LED lamps
  • Radiator structure applied to LED lamps

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Embodiment Construction

[0022] The present invention will be further described below in conjunction with the accompanying drawings.

[0023] Such as Figures 1 to 4 As shown, a heat sink structure applied to LED lamps according to the present invention includes a lampshade 3, a heat dissipation housing 5 and a sealing cover plate 6; a circuit board 2 and an aluminum substrate 4 are fixed inside the lampshade 3 The front surface of the circuit board 2 is provided with several LED lamp beads 1; the LED lamp beads 1 are evenly distributed on the circuit board 2; the heat dissipation shell 5 is cylindrical; the heat dissipation shell 5 is sealed at one end; the other end of the heat dissipation housing 5 is open; one end surface of the aluminum substrate 4 is attached to the circuit board 2; the other end surface of the aluminum substrate 4 is attached to the outside of the sealed end surface of the heat dissipation housing 5; The lampshade 3 is fixed on the outer side of the sealed end face of the heat...

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Abstract

The invention relates to the technical field of lamps, in particular to a radiator structure applied to LED lamps. The radiator structure is characterized in that a circuit board and an aluminum substrate are fixed in a lampshade; LED lamp beads are evenly and circumferentially distributed on the circuit board; the other end face of the aluminum substrate is adhered to the outside of a sealing end face of a radiating shell; the lampshade is fixed on the outside of the sealing end face of the radiating shell; a plurality of external transmitting heat fins are arranged on the outside wall of the radiating shell; a plurality of internal transmitting heat fins are arranged on the inside wall of the radiating shell, and an outer locking thread is in threaded connection with an internal ring thread; an outer sealing ring is pressed between a sealing cover plate and the radiating shell. During use of the radiator structure, heat transmitted from the LED lamp beads is transferred to the sealing end face of the radiating shell via the aluminum substrate and then transferred to the outer transmitting heat fins via the inner transmitting heat fins and the side wall of the radiating shell to be emitted to the air finally; under the situation that heat-conducting property of a radiator is guaranteed in structure, weight of the radiator is reduced, and material cost of the radiator is lowered.

Description

technical field [0001] The invention relates to the technical field of lamps, in particular to a radiator structure applied to LED lamps. Background technique [0002] The traditional LED lamp structure includes LED lamp beads, circuit boards, bases, radiators, etc.; LED lamp beads are installed on the circuit board, and heat transfer and heat dissipation are carried out between the circuit board and the base through thermal silica gel, and the base is generally attached to the base. Closed on the radiator, the heat is dissipated through the radiator; in order to ensure sufficient heat dissipation area, the volume of the radiator is generally made relatively large, and the part where the radiator contacts the base is usually made of solid material for heat conduction; Fins for heat dissipation are arranged around the solid material; although the thermal conductivity of this solid structure is higher than that of a hollow structure radiator; but this kind of lamp is relativ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21V29/77F21V29/56F21Y115/10
CPCF21V29/56F21V29/773F21Y2115/10
Inventor 杨林
Owner 林杨