A kind of fpc device mounting method, fpc component and terminal

A patch and device technology, applied in the FPC device patch method, FPC components and terminal fields, can solve problems such as difficult removal of reinforcement boards
CN107454756BActive Publication Date: 2019-11-15VIVO MOBILE COMM CO LTD
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Patents(China)
Current Assignee / Owner
VIVO MOBILE COMM CO LTD
Publication Date
2019-11-15

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Abstract

The invention provides a flexible printed circuit (FPC) device surface-mounting method, an FPC assembly and a terminal. The method comprises the following steps of pasting a first surface of a reinforcement plate and a first surface of an FPC by an adhesive layer; attaching a target device onto a region, corresponding to the adhesive layer, of a second surface of the FPC; and separating the adhesive layer and the reinforcement plate from the FPC, wherein the first surface of the FPC and the second surface of the FPC are two surfaces, opposite to each other, of the FPC. Therefore, the FPC and the reinforcement plate are pasted to ensure that the FPC is smooth during device surface-mounting on the FPC, the FPC carried with the target device is separated from the adhesive layer after surface mounting of the target device is completed, the purpose of removing the reinforcement plate after FPC surface-mounting is achieved, so that the integral thickness of the FPC device region is thinned, and the thickness space occupied by the FPC is favorably saved.
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Description

technical field

[0001] The invention relates to the field of communication technology, in particular to a method for patching an FPC device, an FPC component and a terminal. Background technique

[0002] FPC (Flexible Printed Circuit, flexible circuit board) is currently widely used in electronic products due to its good bendability and large degree of design freedom. However, the flatness of the FPC itself is poor, and it is easy to cause false soldering problems due to the unevenness of the FPC when the device is placed. This requires bonding a reinforcing plate under the FPC device area to ensure that the FPC under the device is flat during patching. After the existing reinforcing plate is bonded to the FPC, it is difficult to remove the reinforcing plate from the FPC, because the reinforcing plate has a certain thickness, which will occupy extra thickness space. It can be seen that the existing FPC device patching method has the problem that the reinforcing plate is di...

Claims

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