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A kind of fpc device mounting method, fpc component and terminal

A patch and device technology, applied in the FPC device patch method, FPC components and terminal fields, can solve problems such as difficult removal of reinforcement boards

Active Publication Date: 2019-11-15
VIVO MOBILE COMM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Embodiments of the present invention provide a method for mounting FPC devices, FPC components, and terminals to solve the problem that the reinforcement board is difficult to remove in the existing method for mounting FPC devices

Method used

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  • A kind of fpc device mounting method, fpc component and terminal
  • A kind of fpc device mounting method, fpc component and terminal
  • A kind of fpc device mounting method, fpc component and terminal

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Embodiment Construction

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0027] see figure 1 , figure 1 It is a flow diagram of a FPC device placement method, such as figure 1 Shown, a kind of FPC device placement method, comprises the following steps:

[0028] Step 101, bonding the first surface of the reinforcing board and the first surface of the FPC through an adhesive layer.

[0029] Due to the poor flatness of the FPC itself, there may be a problem of virtual soldering due to the unevenness of the FPC when the devi...

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Abstract

The invention provides a flexible printed circuit (FPC) device surface-mounting method, an FPC assembly and a terminal. The method comprises the following steps of pasting a first surface of a reinforcement plate and a first surface of an FPC by an adhesive layer; attaching a target device onto a region, corresponding to the adhesive layer, of a second surface of the FPC; and separating the adhesive layer and the reinforcement plate from the FPC, wherein the first surface of the FPC and the second surface of the FPC are two surfaces, opposite to each other, of the FPC. Therefore, the FPC and the reinforcement plate are pasted to ensure that the FPC is smooth during device surface-mounting on the FPC, the FPC carried with the target device is separated from the adhesive layer after surface mounting of the target device is completed, the purpose of removing the reinforcement plate after FPC surface-mounting is achieved, so that the integral thickness of the FPC device region is thinned, and the thickness space occupied by the FPC is favorably saved.

Description

technical field [0001] The invention relates to the field of communication technology, in particular to a method for patching an FPC device, an FPC component and a terminal. Background technique [0002] FPC (Flexible Printed Circuit, flexible circuit board) is currently widely used in electronic products due to its good bendability and large degree of design freedom. However, the flatness of the FPC itself is poor, and it is easy to cause false soldering problems due to the unevenness of the FPC when the device is placed. This requires bonding a reinforcing plate under the FPC device area to ensure that the FPC under the device is flat during patching. After the existing reinforcing plate is bonded to the FPC, it is difficult to remove the reinforcing plate from the FPC, because the reinforcing plate has a certain thickness, which will occupy extra thickness space. It can be seen that the existing FPC device patching method has the problem that the reinforcing plate is di...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/30
CPCH05K3/30H05K2203/0195
Inventor 易小军谢长虹
Owner VIVO MOBILE COMM CO LTD
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