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Substrate processing device

A substrate processing device and substrate technology, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of narrowing the range of material selection and inability to form holding parts, etc.

Active Publication Date: 2017-12-29
DAINIPPON SCREEN MTG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, the holding portion cannot be formed of a material other than the conductive material, so the selection range of the material is narrowed

Method used

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Embodiment approach

[0127] The present invention is not limited to the contents of the above-described embodiments, and various changes can be made within the scope of the present invention.

[0128] For example, in the above-mentioned embodiment, the case where the jig cover 42 covers the entire exposed portion of the conductive member 41 in a plan view has been described, but the jig cover 42 may cover only a part of the exposed portion in a plan view. The jig cover 42 may also be omitted.

[0129] The softening temperature of the entire core material 40 may be the same as or lower than the softening temperature of the entire conductive member 41 . Likewise, the strength of the entire core material 40 may be equal to or lower than the strength of the entire conductive member 41 .

[0130] At least one of the upper facing portion (lower surface 91 a ) of the current conducting member 44 and the lower facing portion (hook portion 88 ) of the jig cover 42 may be omitted as long as the jig cover 4...

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Abstract

A substrate processing apparatus includes a plurality of jig members 13 for holding a substrate W in a horizontal posture by holding a substrate W horizontally and a support member 59 supporting a jig member (13), a fastening member (43) for fastening the clamp member (13) to the support member (59). The clamp member includes a conductive member including a substrate contact portion pressed against an outer peripheral portion of the substrate and a core member supporting the conductive member and being held by the fastening member, And a conductive member forming a ground path that does not pass through the core material and extends from the substrate contact portion to the fastening member. The substrate (W) is grounded via the ground path (95).

Description

technical field [0001] The present invention relates to a substrate processing device for processing a substrate. The substrates to be processed include, for example, semiconductor wafers, substrates for liquid crystal display devices, substrates for plasma displays, substrates for FED (Field Emission Display: field emission displays), substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, and optical disks. Mask substrates, ceramic substrates, solar cell substrates, etc. Background technique [0002] In a manufacturing process of a semiconductor device, a liquid crystal display device, etc., a substrate processing apparatus for processing a substrate such as a semiconductor wafer or a glass substrate for a liquid crystal display device is used. Japanese Unexamined Patent Application Publication No. 2014-241390 discloses a sheet-type substrate processing apparatus that processes sheets one by one. [0003] This substrate processi...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/687
CPCH01L21/67051H01L21/67115H01L21/68721H01L21/68728H01L21/68757H01L21/67098H01L21/6835H01L21/687
Inventor 佐藤昌治天久贤治
Owner DAINIPPON SCREEN MTG CO LTD
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