Ultra-precision surface polishing machining device and method

A processing device and precision polishing technology, used in metal processing equipment, grinding/polishing equipment, manufacturing tools, etc., can solve the problems of strong magnetic field, nozzle wear and damage, nozzle blockage, nozzle size, etc., and achieve surface roughness. Uniform, soft processing erosion force effect

Pending Publication Date: 2018-01-16
SUZHOU UNIV OF SCI & TECH
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AI Technical Summary

Problems solved by technology

[0002] At present, the existing surface ultra-precision processing technology generally uses jet flow and magnetic flow as the carrier for processing, but its existence is such as micropowder agglomeration (when the micropowder is nano-scale, the micropowder has a tendency to agglomerate during the formation of the polishi

Method used

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  • Ultra-precision surface polishing machining device and method
  • Ultra-precision surface polishing machining device and method

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Embodiment

[0016] Such as figure 1 A surface ultra-precision polishing processing device is shown, including: a precise two-dimensional mobile platform 1, a polishing gas mist flow 2, a column with Z-direction precision movement 3, an ultrasonic atomizer 4, an atomizer holder 5, Polishing agent 6, polishing agent input tube 7, intelligent precision micropump 8, current wire 9, ultrasonic power supply 10, Z-axis movement control line 11, workpiece 12, precision two-dimensional platform movement control line 13 and data processing system 14.

[0017] The connection relationship of the above-mentioned components is as follows: the workpiece 12 is fixed on the precision two-dimensional mobile platform 1, and the precision two-dimensional mobile platform 1 is connected with the data processing system 14; the data processing system 14 is also connected with the ultrasonic power supply 10 and the Z-axis mobile control line 11 is connected to the intelligent precision micropump 8, one end of th...

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Abstract

The invention discloses an ultra-precision surface polishing machining device and method. The device comprises a precision two-dimensional moving platform, a standing column precisely moving in the Zdirection, an ultrasonic atomizer, an atomizer holder, an intelligent precision micropump, an ultrasonic power supply and a data processing system. According to the device, the intelligent precision micropump is started to run under the control of the data processing system, polishing agent is conveyed to the ultrasonic atomizer through a polishing agent inputting pipe, then the ultrasonic power supply starts an ultrasonic impulse current under the control of the data processing system, a piezoelectric ceramic plate in the ultrasonic atomizer generates ultrasonic vibration by means of the ultrasonic impulse current, and the polishing agent is atomized into polishing aerosol flow to work on the surface of a workpiece. The ultra-precision surface polishing machining device and method have the advantages that the roughness of the machined surface is uniform, subsurface damage to the workpiece does not occur, and the problems of micro powder agglomeration, nozzle blockage and nozzle wear in the flow-jet polishing machining process do not occur.

Description

technical field [0001] The patent of the present invention relates to precision polishing processing technology, in particular to a "cold and soft" surface ultra-precision polishing processing technology and device. Background technique [0002] At present, the existing surface ultra-precision processing technology generally uses jet flow and magnetic flow as the carrier for processing, but its existence is such as micropowder agglomeration (when the micropowder is nano-scale, the micropowder has a tendency to agglomerate during the formation of the polishing agent water jet. ), nozzle clogging during micro-polishing processing (due to the small size of the micro-polishing water jet nozzle, it is very easy to clog during the process of jet switching), nozzle wear and tear, large impact force and strong magnetic field, etc., which affect its processing effects and scope of application. Contents of the invention [0003] Aiming at the above-mentioned deficiencies in the exi...

Claims

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Application Information

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IPC IPC(8): B24B1/04B24B41/00
Inventor 汪帮富宋娟王中旺丁雯钰殷振
Owner SUZHOU UNIV OF SCI & TECH
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