Micro switch with heat dissipation structure

Abstract

The invention discloses a microswitch with a heat dissipation structure. The microswitch comprises a bottom shell and a face cover, a wire inlet terminal, a wire outlet terminal and a button are arranged on the bottom shell, a connecting feeler lever is arranged inside the bottom shell, a resetting spring is arranged between the button and the inner wall of the bottom shell, clamps are arranged onthe inner wall of the bottom shell, a heat dissipation air-guiding pipe is arranged inside the bottom shell and fixed to the inner wall of the bottom shell through the clamps, a cavity with an opening in the side face is formed in the bottom shell, a bearing plate is arranged inside the cavity, a resetting tension spring is fixed between the end of the bearing plate and the end wall of the cavity, a round hole is formed in the side wall of the bottom shell, air outlet holes are evenly formed in the heat dissipation air-guiding pipe, a heat dissipation window is formed in the side wall of thebottom shell, and a small heat dissipation air blower is further arranged. The microswitch is reasonable in structural arrangement, the overall heat dissipation performance of the microswitch is greatly improved, arc extinguishing of the microswitch is easy, using stability is improved, the service life is prolonged, the application range is enlarged, and practicability is good.

Description

technical field [0001] The invention belongs to the technical field of micro switches, and in particular relates to a micro switch with a heat dissipation structure. Background technique [0002] The micro switch is a common structure. The micro switch of the traditional technology is mainly composed of a bottom case and a cover. The bottom case is provided with an incoming terminal, an outgoing terminal and a button, and a conduction contact is arranged in the bottom case. Rod, the conduction contact rod connects the incoming line terminal and the outgoing line terminal under the action of the button, because the conduction contact rod will also generate a certain amount of heat when it is connected to the incoming line terminal and the outgoing line terminal, especially for a long time In the case of high temperature environment, the heat in the micro switch cannot be dissipated, which will affect the reliability of the connection between the internal conduction contact ro...

AI Technical Summary

Problems solved by technology

[0002] The micro switch is a common structure. The micro switch of the traditional technology is mainly composed of a bottom case and a cover. The bottom case is provided with an incoming terminal, an outgoing terminal and a button, and a conduction contact is arranged in the bottom case. Rod, the conduction contact rod connects the incoming line terminal and the outgoing line terminal under the action of the button, because the conduction contact rod will also generate a certain amount of heat when it is connected to the incoming line terminal and the outgoing line terminal, especially for a long time In the case of high temperature environment, the heat in the micro switch cannot be dissipated, which will affect the reliability of the connection between the internal conduction contact rod and the incoming and outgoing terminals, and affect the normal function of the micro switch, so the applicability and practicality sexually restricted

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