Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Manipulators and semiconductor processing equipment

A manipulator and manipulator technology, applied in the field of manipulators and semiconductor processing equipment, can solve the problems of easy over-adjustment, complicated adjustment process, low adjustment accuracy, etc., to avoid over-adjustment, simplify the adjustment process, and improve the adjustment accuracy.

Active Publication Date: 2020-08-21
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In the process of adjusting the rotation angle of the mechanical finger 2, the rotation angle of the mechanical finger 2 is adjusted by manually turning the mechanical finger 2, the adjustment accuracy is low, and it is easy to adjust excessively, so that the fastening screw 3 needs to be repeatedly loaded and unloaded, resulting in a complicated adjustment process

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Manipulators and semiconductor processing equipment
  • Manipulators and semiconductor processing equipment
  • Manipulators and semiconductor processing equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] In order to enable those skilled in the art to better understand the technical solution of the present invention, the manipulator and semiconductor processing equipment provided by the present invention will be described in detail below in conjunction with the accompanying drawings.

[0029] Figure 3A It is a top view of the manipulator provided by the first embodiment of the present invention. see Figure 3A , the manipulator includes a finger mounting plate 10 and a mechanical finger 11 mounted thereon, and the mechanical finger 11 can rotate around a rotation center 110 in a horizontal plane relative to the finger mounting plate 10 . The horizontal plane is parallel to the surface of the robotic finger 11 for carrying the wafer.

[0030] The manipulator also includes an angle adjustment mechanism, which is used to adjust the rotation angle of the manipulator finger in a threaded manner. The rotation angle can be regarded as the angle between the current position ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a mechanical arm and a semiconductor processing apparatus. The mechanical arm comprises a finger mounting plate, a mechanical finger mounted thereon, and an angle adjustment mechanism, wherein the mechanical finger is rotatable in a horizontal plane relative to the finger mounting plate. The angle adjustment mechanism is configured to adjust the rotation angle of the mechanical finger by a screw-thread fit way. The mechanical arm can reduce the amount of angle adjustment of the mechanical finger, thereby avoiding excessive adjustment, improving adjustment precision, simplifying an adjustment process, and reducing the probability of wafer displacement.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a manipulator and semiconductor processing equipment. Background technique [0002] In the wafer etching process in the fields of integrated circuits, semiconductor lighting, micro-electromechanical systems, etc., plasma dry etching equipment is usually used to complete the wafer etching process. In order to improve the degree of automation and safety of equipment, wafers are generally transported by manipulators or other automated devices. [0003] figure 1 It is a top view of the existing manipulator. see figure 1 , the manipulator includes a finger mounting plate 1 and a mechanical finger 2 mounted thereon, and the mechanical finger 2 can rotate relative to the finger mounting plate 1 in a horizontal plane. Moreover, the manipulator also includes a plurality of fastening screws 3 which are arranged around the rotation center of the manipulator finger 2 to fix the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/677
Inventor 侯宁
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products