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Bracket-free packaged LED light source and preparation method thereof

An LED light source, no bracket technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of increased bracket cost, poor sealing, poor glue bonding, etc., to save costs, improve sealing, and reduce machine labor costs Effect

Pending Publication Date: 2018-01-26
SHENZHEN LEPOWER CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The general packaging method of the existing LED light source is to use the PCB or the bracket as the carrier. On this basis, the solder spot powder is solidified, and the substrate is indispensable for repackaging. The material of the substrate is usually composed of plastic and metal, such as the traditional SMD patch brackets, and EMC brackets, such brackets usually have problems such as poor sealing and poor bonding with glue, and the cost of the bracket will also increase

Method used

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  • Bracket-free packaged LED light source and preparation method thereof
  • Bracket-free packaged LED light source and preparation method thereof
  • Bracket-free packaged LED light source and preparation method thereof

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Embodiment Construction

[0065] The present invention is further described below in conjunction with accompanying drawing and embodiment:

[0066] Such as Figure 1 to Figure 5 As shown, a packaged LED light source without a support includes a silver-plated copper sheet 1, a first mold top glue 2, a chip 3 and a second mold top glue 4, and the silver-plated copper sheet 1 is provided with a first mold top glue 2 and connected with the first mold top glue 2, the chip is located on the first mold top glue 2 and connected with the first mold top glue 2, the second mold top glue seal 8 is installed on the first mold top glue 2 and The chip is encapsulated in the second top mold compound 4 .

[0067] The beneficial effects of the bracketless packaged LED light source provided in this embodiment are as follows: the bracketless packaged LED light source provided by the present invention is packaged with mold top glue after the silver-plated copper sheet 1 is solid-welded, which improves the sealing performa...

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Abstract

The invention discloses a bracket-free packaged LED light source, which comprises a silver plated copper piece, a first molding adhesive, a wafer and a second molding adhesive, and is characterized inthat the silver plated copper piece is provided with the first molding adhesive thereon and is connected with the first molding adhesive, the wafer is arranged on the first molding adhesive and is connected with the first molding adhesive, the second molding adhesive is packaged on the first molding adhesive, and the wafer is packaged in the second molding adhesive. Another purpose of the invention lies in providing a preparation method of the bracket-free packaged LED light source. The preparation method comprises the steps of S1, preparing materials; S2, manufacturing a silver plated copperpiece; and S3, performing an LED packaging process on the silver plated copper piece. According to the bracket-free packaged LED light source provided by the invention, the molding adhesives are adopted for packaging after the silver plated copper piece is fixed and welded, the sealing performance is improved, and the combination of the silver plated copper piece and the molding adhesives is provided. Meanwhile, the traditional bracket is removed, a bracket-free packaging mode is realized, the machine and labor cost at the upstream and the downstream is greatly reduced, and the cost is saved.

Description

technical field [0001] The invention relates to a bracket-free packaged LED light source and a preparation method thereof. Background technique [0002] The general packaging method of the existing LED light source is to use the PCB or the bracket as the carrier. On this basis, the solder spot powder is solidified, and the substrate is indispensable for repackaging. The material of the substrate is usually composed of plastic and metal, such as the traditional SMD patch brackets, and EMC brackets, such brackets usually have problems such as poor sealing and poor bonding with glue, and the cost of the bracket will also increase. [0003] The above deficiencies need to be improved. Contents of the invention [0004] In order to overcome the deficiencies of the existing technology, the present invention provides a bracketless packaged LED light source and a preparation method thereof. [0005] Technical solution of the present invention is as follows: [0006] A packaged L...

Claims

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Application Information

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IPC IPC(8): H01L33/54H01L33/62
CPCH01L33/54H01L33/62
Inventor 马志华屈军毅
Owner SHENZHEN LEPOWER CO LTD
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