Method for compensating effects of substrate stresses in semiconductor devices, and corresponding device
A semiconductor and stress sensor technology, applied in the direction of semiconductor devices, semiconductor/solid-state device components, semiconductor/solid-state device testing/measurement, etc., can solve the problems of bare chip cost limitation, increased space occupation, etc.
Active Publication Date: 2018-01-30
STMICROELECTRONICS SRL
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While interesting, this solution presents limitations in terms of footprint and cost of increasing the die such that it may be considered unsuitable for standard production devices
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[0029] In the ensuing description, various specific details are set forth in order to provide a thorough understanding of various examples of embodiments of the present disclosure. The embodiments may be derived without one or more of the specific details or with the use of other methods, components, materials, and the like. In other instances, well-known structures, materials, or operations have not been illustrated or described in detail so as not to obscure aspects of the embodiments.
[0030] Reference to "an embodiment" or "one embodiment" within the framework of this specification is intended to indicate that a particular configuration, structure, or characteristic described in relation to the embodiment is included in at least one embodiment. Thus, phrases such as "in an embodiment" or "in one embodiment" that may appear in various points of this specification are not necessarily all referring to the same embodiment. Furthermore, the particular formations, structures, ...
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A method for compensating effects of substrate stresses in semiconductor devices, and a corresponding device are disclosed. A semiconductor device comprises a substrate including a first portion and asecond portion. At least one first deformation-stress sensor capable of supplying a first stress signal is coupled to the first portion of the substrate. At least one second deformation-stress sensorcapable of supplying a second stress signal is coupled to the second portion of the substrate. A processing circuit is provided and is coupled to the first deformation-stress sensor and the second deformation-stress sensor, and is configured to process the first stress signal and the second stress signal to produce a compensation signal according to the first stress signal and the second stress signal. The compensation signal is applied to a signal generated by the semiconductor circuit to compensate for variations of the generated signal caused by stresses in the substrate of the semiconductor device.
Description
technical field [0001] The present disclosure relates to semiconductor devices. [0002] One or more embodiments may be applied to compensate for effects caused by substrate stress in semiconductor devices. Background technique [0003] In the manufacture of semiconductor devices, an important aspect is represented by the possible role of the packaging of the device. [0004] Therefore, one of the routes followed in the context of reducing the cost of these devices is the pursuit of reducing the cost of the package, eg by reducing the cost of the metal frame (on which the chip is attached) and the resin within the package. [0005] This saving may have an impact on the thickness of the frame and / or on the quality of the resin, and may - in particular, lead to low cost devices designed for consumer products - to the output voltage V of the device as after assembly 输出 shift. [0006] This phenomenon can be amplified by the possible stress, in the sense that it is possible t...
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Patent Timeline
Login to View More IPC IPC(8): H01L23/00H01L21/66
CPCH01L23/34H01L22/34G01L1/00G01R17/12G01B7/18H03K3/011
Inventor G·斯希拉
Owner STMICROELECTRONICS SRL