Method for compensating the effect of substrate stress in a semiconductor device and corresponding device
A technology of semiconductors and devices, applied in the field of semiconductor devices, can solve the problems of cost limitation of bare chips, increase of occupied space, etc.
Active Publication Date: 2021-06-15
STMICROELECTRONICS SRL
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Problems solved by technology
While interesting, this solution presents limitations in terms of footprint and cost of increasing the die such that it may be considered unsuitable for standard production devices
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[0029] In the ensuing description, various specific details are set forth in order to provide a deeper understanding of various examples of embodiments of the present disclosure. Embodiments may be drawn without one or more of the specific details or with the use of other methods, components, materials, etc. In other instances, known structures, materials, or operations are not detailed or described so as not to obscure aspects of the embodiments.
[0030] References to "an embodiment" or "one embodiment" in the framework of this specification are intended to indicate that a particular configuration, structure, or characteristic described with respect to the embodiment is included in at least one embodiment. Thus, phrases such as "in an embodiment" or "in one embodiment," which may appear at various points in this specification, are not necessarily referring to exactly the same embodiment. Furthermore, particular formations, structures, or characteristics may be substantively...
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A method and corresponding device for compensating the effects of substrate stress in a semiconductor device are disclosed. A semiconductor device includes a substrate having a first portion and a second portion. Coupled to the first portion of the substrate is at least one first deformation stress sensor capable of providing a first stress signal, and coupled to the second portion of the substrate is at least one second stress sensor capable of providing a second stress signal. Deformation stress sensor. A processing circuit is provided, the processing circuit is coupled to the first deformation stress sensor and the second deformation stress sensor, and is configured to: process the first stress signal and the second stress signal so that according to the first a stress signal and the second stress signal generate a compensation signal and apply the compensation signal to a signal generated by the semiconductor circuit to compensate for variations in the generated signal caused by stress in the substrate of the semiconductor device .
Description
technical field [0001] The present disclosure relates to semiconductor devices. [0002] One or more embodiments may be applied to compensate for effects caused by substrate stress in semiconductor devices. Background technique [0003] In the manufacture of semiconductor devices, an important aspect is represented by the possible role of the packaging of the device. [0004] Therefore, one of the lines followed in the context of reducing the cost of these devices is the reduction of the cost of the package, pursued for example by reducing the cost of the metal frame on which the chip is attached, as well as the resin inside the package. [0005] This saving may have an effect on the thickness of the frame and / or on the quality of the resin, and may—in particular, result in a low-cost device designed for use in consumer goods—lead to an output voltage of the device such as V 输出 shift. [0006] This phenomenon can be amplified by possible stresses, in the sense that it is ...
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IPC IPC(8): H01L23/00H01L21/66
CPCH01L23/34H01L22/34G01L1/00G01R17/12G01B7/18H03K3/011
Inventor G·斯希拉
Owner STMICROELECTRONICS SRL