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Semiconductor structure

A technology of semiconductor and conductive pads, applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc.

Inactive Publication Date: 2018-01-30
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The sealing ring structure is disposed on the integrated circuit device and surrounds the conductive pad

Method used

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  • Semiconductor structure
  • Semiconductor structure
  • Semiconductor structure

Examples

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Embodiment Construction

[0037] The following disclosure provides many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below for the purpose of conveying the present invention in a simplified form. Of course, this is for example only and not for limitation. In addition, the present invention may use the same reference symbols and / or letters in various examples to refer to the same or similar components. Reuse of element symbols is for simplicity and clarity and does not imply a relationship between the various embodiments and / or arrangements themselves that are being discussed.

[0038] In addition, in order to easily describe the relationship between one component or feature and another component or feature depicted in the drawings, for example, "under", "under", "lower part", "below", etc. may be used herein. Spatially relative terms for "on", "above", "upper" and similar terms. ...

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Abstract

A semiconductor structure has an integrated circuit component, a conductive contact pad, a seal ring structure, a conductive via, a ring barrier, and a mold material. The conductive contact pad is disposed on and electrically connected with the integrated circuit component. The seal ring structure is disposed on the integrated circuit component and surrounding the conductive contact pad. The conductive via is disposed on and electrically connected with the conductive contact pad. The ring barrier is disposed on the seal ring structure. The ring barrier surrounds the conductive via. The mold material covers side surfaces of the integrated circuit component. The semiconductor structure has relatively good structural strength and reliability.

Description

technical field [0001] Embodiments of the present invention relate to a semiconductor structure, and more particularly to a semiconductor structure with better structural strength and reliability. Background technique [0002] Integrated circuits have been widely used in the field of electronic devices such as personal computers, mobile phones, digital cameras and other electronic devices. Integrated circuits generally form circuit components and components thereon by sequentially depositing insulating or dielectric layers, conductive layers, and semiconductor layers on a semiconductor substrate, and patterning the above-mentioned material layers using photolithography techniques. Generally speaking, multiple integrated circuits can be fabricated on a single semiconductor wafer. Chips on a wafer can be processed and packaged at the wafer level, and various technologies have been developed for wafer level packaging. Contents of the invention [0003] The invention provide...

Claims

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Application Information

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IPC IPC(8): H01L23/498
CPCH01L23/585H01L2224/18H01L2924/18162H01L21/566H01L24/19H01L24/20H01L23/3128H01L2924/0001H01L23/3185H01L23/5226H01L24/05H01L24/17H01L2224/0237H01L2924/01013H01L2924/01022H01L2924/01028H01L2924/01029H01L2924/01074
Inventor 赖昱嘉余振华黄章斌刘重希杜贤明郭鸿毅蔡豪益梁世纬刘人瑄
Owner TAIWAN SEMICON MFG CO LTD