Dustproof cooling case of computer

A chassis and computer technology, applied in the field of dust-proof and heat-dissipating chassis, can solve the problems of unsatisfactory air-cooling heat dissipation, complicated installation of water-cooling heat dissipation, high noise, etc., and achieve the effects of simple structure, dust prevention and low noise.

Inactive Publication Date: 2018-02-09
孝感市奇乐创意设计有限公司
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Problems solved by technology

Now the most common heat dissipation methods are air cooling and water cooling, which are gradually popularized. However, the effect of air

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  • Dustproof cooling case of computer
  • Dustproof cooling case of computer

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[0014] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0015] Reference attached figure 1 , 2 As shown, a dust-proof and heat-dissipating case for a computer mainly includes a case, a semiconductor cooling chip, a water-cooled box, and a water pump. The case includes a first side, a second side, a third side, a fourth side, a top cover, and a bottom surface; The water pump is fixedly connected to the outside of the first side surface; the semiconductor refrigeration fin is fixedly installed on the ...

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Abstract

A dust-proof and heat-dissipating chassis for a computer, mainly comprising a chassis, a semiconductor cooling chip, a water cooling box and a water pump, the semiconductor cooling chip is fixedly installed on the inner side of the first side, and the cold water tank is fixedly connected to the hot end of the semiconductor cooling chip; The cold water tank is fixedly connected with the water inlet pipe, the water inlet pipe is also fixedly connected with the water pump, and the water pump is also equipped with an outlet pipe, and the water outlet pipe is fixedly connected with the cold water tank; the bottom surface is also equipped with a pulley; the semiconductor The refrigerating sheet is formed by laminating two layers of semiconductor refrigerating sheets, the cold section of the upper layer of semiconductor refrigerating sheet is bonded to the hot end of the lower layer of semiconductor refrigerating sheet; the semiconductor refrigerating sheet is also equipped with a wiring port; the pulley is a self-locking pulley. The invention can quickly cool down the CPU through the semiconductor refrigeration sheet, the closed casing can effectively prevent dust from entering, low noise during operation, simple structure, convenient and practical.

Description

technical field [0001] The present invention relates to the field of computer supporting equipment, in particular to a computer dust-proof and heat-dissipating chassis. Background technique [0002] The CPU and other components of the computer will generate heat during high-speed operation. Heat dissipation is actually a process of heat transfer. The purpose is to transfer the heat generated by the CPU to other media and control the CPU temperature within a stable range. According to our life environment, the heat of the CPU will eventually be dissipated into the air, and this process is the cooling of the computer. Now the most common heat dissipation methods are air cooling and gradually popularized water cooling, but the effect of air cooling is not ideal and the noise is very loud. Although the effect of water cooling has been improved, the installation is more cumbersome. Contents of the invention [0003] The object of the present invention is to provide a dust-pr...

Claims

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Application Information

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IPC IPC(8): G06F1/18G06F1/20
CPCG06F1/181G06F1/20
Inventor 王侃
Owner 孝感市奇乐创意设计有限公司
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