Dustproof cooling case of computer

Abstract

A dust-proof and heat-dissipating chassis for a computer, mainly comprising a chassis, a semiconductor cooling chip, a water cooling box and a water pump, the semiconductor cooling chip is fixedly installed on the inner side of the first side, and the cold water tank is fixedly connected to the hot end of the semiconductor cooling chip; The cold water tank is fixedly connected with the water inlet pipe, the water inlet pipe is also fixedly connected with the water pump, and the water pump is also equipped with an outlet pipe, and the water outlet pipe is fixedly connected with the cold water tank; the bottom surface is also equipped with a pulley; the semiconductor The refrigerating sheet is formed by laminating two layers of semiconductor refrigerating sheets, the cold section of the upper layer of semiconductor refrigerating sheet is bonded to the hot end of the lower layer of semiconductor refrigerating sheet; the semiconductor refrigerating sheet is also equipped with a wiring port; the pulley is a self-locking pulley. The invention can quickly cool down the CPU through the semiconductor refrigeration sheet, the closed casing can effectively prevent dust from entering, low noise during operation, simple structure, convenient and practical.

Description

technical field [0001] The present invention relates to the field of computer supporting equipment, in particular to a computer dust-proof and heat-dissipating chassis. Background technique [0002] The CPU and other components of the computer will generate heat during high-speed operation. Heat dissipation is actually a process of heat transfer. The purpose is to transfer the heat generated by the CPU to other media and control the CPU temperature within a stable range. According to our life environment, the heat of the CPU will eventually be dissipated into the air, and this process is the cooling of the computer. Now the most common heat dissipation methods are air cooling and gradually popularized water cooling, but the effect of air cooling is not ideal and the noise is very loud. Although the effect of water cooling has been improved, the installation is more cumbersome. Contents of the invention [0003] The object of the present invention is to provide a dust-pr...

AI Technical Summary

Problems solved by technology

Now the most common heat dissipation methods are air cooling and water cooling, which are gradually popularized. However, the effect of air cooling is not ideal and the noise is very loud. Although the effect of water cooling has been improved, the installation is more cumbersome.

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