Method for identifying defect profile of pseudo three-dimensional magnetic flux leakage signal based on normal component
A technology of normal component and identification method, which is applied in the field of non-destructive testing, can solve the problem of high requirements on the acquisition position and accuracy of three-dimensional magnetic flux leakage signals, the inability to meet the requirements of defect identification accuracy, increase the development cost and design difficulty of magnetic flux leakage detection devices, etc. problem, to achieve good recognition effect and high solution accuracy
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0033] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.
[0034] A method for identifying a defect contour of a pseudo three-dimensional magnetic flux leakage signal based on a normal component according to an embodiment of the present invention will be described below with reference to the accompanying drawings.
[0035] figure 1 It is a flowchart of a method for identifying a defect contour of a pseudo three-dimensional magnetic flux leakage signal based on a normal component in an embodiment of the present invention.
[0036] Such as figure 1 As shown, the pseudo three-dimensional ...
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com