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A method for additive manufacturing metal composite board with built-in circuit

A metal composite board and additive manufacturing technology, applied in the field of additive manufacturing, can solve the problems of reducing the mechanical properties of composite boards and increasing processing costs, and achieve the effects of improving mechanical properties, improving forming efficiency, and expanding application fields

Active Publication Date: 2019-08-13
ZHONGBEI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The composite metal plate prepared by this method cannot be integrated with the internal circuit board, which reduces the mechanical properties of the composite plate and increases the processing cost

Method used

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  • A method for additive manufacturing metal composite board with built-in circuit
  • A method for additive manufacturing metal composite board with built-in circuit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Example 1: A method for additively manufacturing iron-aluminum composite panels with built-in circuits

[0031] (1) Model the iron-aluminum composite board that needs a built-in circuit, set the circuit path and position in the iron-aluminum composite board, repair the model with Magic software, and then slice the model with Autofab software, the thickness of the slice is iron foil The thickness of the material, in which the thickness of the iron foil material is the same as that of the aluminum foil material. The forming accuracy is controlled at 1mm;

[0032] (2) Cut out the circuit path on the iron foil material according to the set circuit path. The thickness of the iron foil is 0.5mm, the rotation speed of the cutter is 50r / s, the moving speed of the cutter is 0.5m / s, and the chamfering of the edge of the cutter is 0.5mm; after cutting, clean the iron foil with alcohol and dry it;

[0033] (3) The iron foil material is consolidated and formed by an ultrasonic con...

Embodiment 2

[0040] A method for additively manufacturing titanium-aluminum composite board with built-in circuit

[0041] (1) Model the titanium-aluminum composite board that needs a built-in circuit, set the circuit path and position in the titanium-aluminum composite board, repair the model with Magic software, and then slice the model with Autofab software, the thickness of the slice is titanium foil The thickness of the material, in which the thickness of the titanium foil is the same as that of the aluminum foil. The forming accuracy is controlled at 1mm;

[0042] (2) Cut out the circuit path on the titanium foil according to the set circuit path. The thickness of the titanium foil is 0.2mm, the rotation speed of the cutter is 80r / s, the moving speed of the cutter is 0.8m / s, and the chamfering of the cutter boundary is 0.8mm; after cutting, clean the iron foil with alcohol and dry it;

[0043] (3) Consolidate the titanium foil into shape through an ultrasonic consolidation device. ...

Embodiment 3

[0050] A method for additively manufacturing titanium-iron composite board with built-in circuit

[0051] (1) Model the titanium-iron composite board that needs a built-in circuit, set the circuit path and position in the titanium-iron composite board, use Magic software to repair the model, and then use Autofab software to slice the model, and the thickness of the slice is titanium foil The thickness of the material, in which the thickness of the titanium foil is the same as that of the iron foil. The forming accuracy is controlled at 0.5mm;

[0052](2) Cut out the circuit path on the titanium foil according to the set circuit path. The thickness of the titanium foil is 0.3mm, the rotation speed of the cutter is 90r / s, the moving speed of the cutter is 0.75m / s, and the chamfering of the cutter boundary is 0.5mm; after cutting, clean the iron foil with alcohol and dry it;

[0053] (3) Consolidate the titanium foil into shape through an ultrasonic consolidation device. The u...

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Abstract

The invention discloses a method of additively manufacturing metal composite board with a built-in circuit and belongs to the field of additively manufacturing. A technical problem is solved by providing such method, by which a circuit is directly wrote to the metal composite board, so that the circuit and the metal composite board are manufactured at the same time to form the integrated metal composite board with the built-in circuit via the additively manufacturing. In one technical scheme for solving the problem, the method includes the steps of: pre-cutting preset circuit paths in a metalfoil material; performing ultrasonic consolidation shaping to the metal foil material; and successively filling the circuit paths with an insulation material, a conductive material and an insulation material, and integrating the circuit with the metal composite board. The method can be widely applied to the field of additively manufacturing.

Description

technical field [0001] The invention relates to a method for additively manufacturing a metal composite board with a built-in circuit, which belongs to the technical field of additive manufacturing. Background technique [0002] Ultrasonic metal consolidation forming technology uses high-power ultrasonic energy, uses metal foil as raw material, and uses the heat generated by the vibration and friction of metal layers to cause local severe plastic deformation of the material, thereby achieving physical metallurgical bonding between atoms and realizing simultaneous A special method of solid-state bonding between one or dissimilar metal materials. On the basis of metal ultrasonic consolidation forming technology, combined with CNC milling and other processes, the integration of ultrasonic additive forming and intelligent manufacturing can be realized. This technology has attracted widespread attention due to its advantages in energy saving, environmental protection, high effic...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B15/04B32B3/08
CPCB32B3/08B32B15/043
Inventor 赵占勇白培康李亮吴利芸李婧谭乐李忠华李晓峰王宇
Owner ZHONGBEI UNIV
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