A kind of encapsulation structure and method of amoled
A technology of packaging structure and packaging method, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of affecting display effect, hard and brittle, intrusion path, etc., and achieve the effect of improving product reliability and process yield.
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[0028] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention.
[0029] Such as Figure 3-6 As shown, the present invention discloses an AMOLED packaging structure. Specifically, the structure includes a substrate 1 having a display area and a frame area surrounding the display area, a display device 4 disposed on the display area of the substrate 1 , and a display device 4 disposed on the substrate 1. The metal backing layer 2 in the frame area, the cover plate 5 arranged opposite to the substrate 1, and the encapsulation glue arranged between the metal backing layer 2 and the cover plate 5 to encapsulate the display device 4 between the substrate 1 and the cover plate 5 3. The metal backing layer includes multiple metal layers arranged at intervals, so that the stress of the metal backing layer 2 can be effectively released, and can effectively block the ...
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