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A kind of encapsulation structure and method of amoled

A technology of packaging structure and packaging method, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of affecting display effect, hard and brittle, intrusion path, etc., and achieve the effect of improving product reliability and process yield.

Active Publication Date: 2020-02-21
EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] like figure 1 and figure 2 As shown, the glass collagen is originally designed to be coated in a ring-shaped large circle structure, and is single-coated on the encapsulation area on the large-area metal layer 101. If the metal layer 101 has a rough phenomenon (see crack 102), the crack 102 It will extend or even run through the entire glass glue coating area; the metal layer itself is very hard and brittle (especially when the whole machine is shaken and dropped or 4PB reliability verification, it is easy to show), as long as there is a small part of the metal The starting point will extend from the border area to the display area of ​​the panel along the trend, thereby creating a water vapor intrusion path and affecting the display effect

Method used

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  • A kind of encapsulation structure and method of amoled
  • A kind of encapsulation structure and method of amoled
  • A kind of encapsulation structure and method of amoled

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Embodiment Construction

[0028] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention.

[0029] Such as Figure 3-6 As shown, the present invention discloses an AMOLED packaging structure. Specifically, the structure includes a substrate 1 having a display area and a frame area surrounding the display area, a display device 4 disposed on the display area of ​​the substrate 1 , and a display device 4 disposed on the substrate 1. The metal backing layer 2 in the frame area, the cover plate 5 arranged opposite to the substrate 1, and the encapsulation glue arranged between the metal backing layer 2 and the cover plate 5 to encapsulate the display device 4 between the substrate 1 and the cover plate 5 3. The metal backing layer includes multiple metal layers arranged at intervals, so that the stress of the metal backing layer 2 can be effectively released, and can effectively block the ...

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Abstract

The present invention relates to the technical field of displays, in particular to an AMOLED packaging structure and method. By preparing a metal pad layer in the packaging area including a plurality of metal layers arranged at intervals, the stress of the metal pad layer can be effectively released, and the Effectively block the water vapor intrusion path caused by cracks in the metal, thereby improving product reliability and process yield.

Description

technical field [0001] The invention relates to the technical field of displays, in particular to an AMOLED packaging structure and method. Background technique [0002] OLED is an Organic Light-Emitting Diode (Organic Light-Emitting Diode), which has the characteristics of self-illumination, high brightness, wide viewing angle, high contrast, flexibility, and low energy consumption. It began to gradually replace traditional liquid crystal displays and was widely used in mobile phone screens, computer monitors, full-color TVs, etc. [0003] With the continuous development of display technology, the market demand for narrow-frame displays is increasing, which puts forward higher requirements for the packaging technology of the display; at present, the packaging process of AMOLED Frit (glass glue) mainly depends on glass glue. For the packaging and fixing of the upper and lower glass, the width of the glass glue and the process capability will determine the width and reliabil...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/52H01L51/56
CPCH10K50/841H10K71/00
Inventor 蔡学明
Owner EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD