Circuit materials and articles formed therefrom
A technology of circuit and dielectric layer, applied in circuit materials, explained in this field
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Examples
Embodiment 1A
[0109] This example illustrates the preparation of poly(TAIC) particles for use as formulation additives in circuit materials. Free radical emulsion polymerization of triallyl isocyanurate (TAIC) monomer was carried out as shown in the following formula:
[0110]
[0111] Specifically, 3100 grams of DI (deionized) water and 500 grams of triallyl isocyanurate (TAIC) were added to a stainless steel container. In another container, 22 grams of ammonium persulfate was dissolved in 110 grams of DI water. On a hot plate, the DI water / TAIC mixture was heated to 70°C with high shear mixing. Add 0.5g Triton X (octoxynol-9) emulsifier. While maintaining the temperature at 70°C to 80°C, eleven additions (12 grams each) of the ammonium persulfate / DI aqueous solution were added over 4.5 hours. The time between additions was 25 minutes. The reaction vessel was then capped and placed in an oven (60°C) overnight (16 hours). After cooling to room temperature, the resulting product (p...
Embodiment 2 to Embodiment 3
[0113] The formulations of Example 2 and Example 3 of the present invention (amounts are parts by weight except for the weaving reinforcing layer), their characteristics and results are shown in Table 2.
[0114] Table 2
[0115]
[0116] Test results show that the use of TAIC polymers has a positive effect on electrical properties (Dk and Df), thermal properties (Tg, CTE, Td and solder testing) and processing properties (coating, lamination and drilling).
Embodiment 4 to Embodiment 5
[0118] The formulations of Example 4 and Example 5 of the present invention were prepared as shown in Table 3 (amounts used are parts by weight except for the reinforcing layer). Example 4 uses a brominated flame retardant system, and Example 5 uses a halogen-free flame retardant system. Standard resin epoxy lamination is performed. Properties and results are also shown in Table 3.
[0119] table 3
[0120]
[0121] Based on the results in Table 3, it has been demonstrated that for halogenated (Example 3) and halogen-free (Example 4) compositions, combinations with improved physical and electrical properties (including low D f ) circuit material, even if the content of inorganic filler is reduced. Example 4 exhibited greater peel strength and lower D f , while the halogen-free Example 5 exhibited a higher decomposition temperature while exhibiting comparable characteristics in other properties. It was further observed that the use of poly(TAIC) particles as the rheolog...
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Abstract
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