Using method for circuit board punching mechanism capable of conducting marking

A circuit board, punching pin technology, applied in printing, stamping, metal processing and other directions, can solve the problems of circuit board production process and marking process can not be carried out at the same time, waste of manpower and economic costs, to reduce counterfeit production. risk, improve the reliability of operation, and improve the effect of anti-counterfeiting

Inactive Publication Date: 2018-03-27
SHANGHAI NCATEST TECH CO LTD
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the actual situation is that the production process of the circuit board and the marking process cannot be carried out at the same time, which greatly wastes manpower and economic costs.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Using method for circuit board punching mechanism capable of conducting marking

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0012] The present invention will be further described below in conjunction with specific examples.

[0013] The present invention will be described in detail below in conjunction with specific embodiments shown in the accompanying drawings. However, these embodiments do not limit the present invention, and any structural, method, or functional changes made by those skilled in the art according to these embodiments are included in the protection scope of the present invention.

[0014] The application principle of the present invention will be further described below in conjunction with the accompanying drawings and specific embodiments. as attached figure 1 As shown, the circuit board punching mechanism capable of marking includes a base 1, the base 1 is provided with a base plate 2, and the base plate 2 is fixedly provided with a punching device 3 and a marking device 4. The hole device 3 and the marking device 4 are distributed at 90 degrees. The punch device 3 includes a...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a using method for a circuit board punching mechanism capable of conducting marking. The punching problem of a circuit board is solved, and the difficulty of marking of the circuit board in the production process of the circuit board is also solved. By arranging a marking device, different types of markers can be printed to the circuit board, the anti-counterfeiting degreeis improved, the risk that the circuit board is produced by other manufacturers in a counterfeiting manner is reduced, moreover, the operation in the whole process is extremely easy, the precision degree is extremely high, the manufacturing cost is low, the function is remarkably enhanced, and the high efficiency of the whole circuit board punching mechanism and the operation reliability are greatly improved.

Description

technical field [0001] The invention relates to the field of punching holes and anti-counterfeiting of circuit boards, more specifically, relates to a method for using a circuit board punching mechanism capable of marking. Background technique [0002] The circuit board is an important electronic component, a support for electronic components, and a carrier for the electrical connection of electronic components, which plays a very important role. In the process of circuit board production and use, the punching process is an indispensable process, and looking at the current market, each semiconductor manufacturer cherishes the fruits of their labor, and the anti-counterfeiting awareness has been significantly improved, so each semiconductor manufacturer in their own production The circuit board will be marked with its own anti-counterfeiting mark to prevent counterfeiting. However, the actual situation is that the production process procedure and the marking procedure of the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): B26F1/24B41K3/02
CPCB26F1/24B41K3/02
Inventor 胡忠臣
Owner SHANGHAI NCATEST TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products