Immersed mask cooling apparatus and immersed mask cooling method

Abstract

The invention relates to an immersed mask cooling apparatus and an immersed mask cooling method. The immersed mask cooling apparatus comprises a cooling framework enclosed outside a mask, wherein thetop portion of the cooling framework is provided with a transparent cover plate, the cooling framework and the transparent cover plate are connected in a sealed manner, the inner side wall of the cooling framework, the upper surface of the mask and the lower surface of the transparent cover plat form a closed space, and the closed space is filled a flowing refrigerant. According to the present invention, on the structure basis of the original mask table, the cooling framework capable of directly cooling the periphery and the surface of the mask is additionally arranged so as to rapidly cool the mask in the immersed manner; and the top portion of the cooling framework is the transparent cover plate, such that the exposure process of the mask cannot be affected.

Description

technical field [0001] The invention relates to the field of photolithography equipment, in particular to an immersion mask cooling device and cooling method. Background technique [0002] In the manufacture of IC and TFT-LCD, photolithography machine is one of the most important and precise equipment. As the feature size made by lithography becomes smaller and smaller, the required exposure wavelength λ is also shorter and shorter, so the exposure light source also gradually transitions from the I-line (365nm) of the mercury lamp to KrF (248nm) and ArF (193nm) laser light source and even EUV (13.5nm) light source for laser plasma. [0003] Regardless of the light source, when the light source irradiates the mask, part of the light passes through the mask and passes through a specific imaging system to form the desired lithographic image on the surface of the substrate, while the remaining part is captured by the metal chromium on the mask. Layers reflect or absorb. The m...

AI Technical Summary

Problems solved by technology

However, during exposure, since the mask is irradiated by a high-energy, high-dose light source for a long time, such cooling is far from enough for the cooling of the mask itself, and the mask will be severely deformed due to thermal expansion, thereby making the pattern formed on the wafer or glass substrate Insufficient accuracy or misalignment of front and rear layers

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