Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A coupler and optical module

A technology of optical coupling and coupling area, applied in the field of optical communication applications, can solve the problems of low optical coupling efficiency of semiconductor lasers and silicon optical chips, etc.

Active Publication Date: 2020-09-11
HISENSE BROADBAND MULTIMEDIA TECH
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to solve the technical problem of low optical coupling efficiency of semiconductor lasers and silicon optical chips in the related art, the present disclosure provides a coupler and an optical module

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A coupler and optical module
  • A coupler and optical module
  • A coupler and optical module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the present invention. Rather, they are merely examples of apparatuses and methods consistent with aspects of the invention as recited in the appended claims.

[0037] Such as figure 1 As shown, the present invention provides a coupler 1100 . figure 1 is a schematic structural diagram of the coupler 1100, Figure 7-17 It is a schematic cross-sectional view of different regions of the coupler 1100 in the length direction and a spot diagram formed by the cross-section of light passing through different regions.

[0038] Such as figure 1 As shown, the coup...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a coupler and an optical module. The coupler is composed of a plurality of waveguides with gradually changing width and height. Along the length direction of the optical coupler, the front coupling area and the optical coupling area are sequentially arranged. Since the width and thickness of the front-end waveguide in the front-end coupling region are the smallest at the light-incident end, the optical coupler has multiple waveguide tips, and the mode spots of the multiple waveguide tips overlap each other, which can realize the matching between the optical coupler mode spot and the laser output mode spot. Matching, the light output by the laser is coupled into the silicon optical chip. The coupler has the advantages of simple structure and high optical coupling efficiency.

Description

technical field [0001] The present disclosure relates to the technical field of optical communication applications, in particular to a coupler and an optical module. Background technique [0002] With the increasingly higher bandwidth requirements for information transmission, the optical communication market has an increasing demand for high-speed optical modules above 100Gbps. It has become an urgent need to develop high-bandwidth, low-cost and high-integration high-speed optical modules using silicon photonics integration technology. [0003] At present, passive silicon optical devices such as high-speed silicon optical modulators, high-speed detectors, low-loss transmission waveguides, and wavelength division multiplexing have been fabricated on silicon optical chips. And it realizes single-channel 25Gpbs or 50Gbps information transmission by integrating various functional devices on the same silicon photonics chip. [0004] However, silicon is an indirect bandgap mate...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G02B6/42
CPCG02B6/4206G02B6/4291
Inventor 隋少帅
Owner HISENSE BROADBAND MULTIMEDIA TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com