Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Array substrate, manufacturing method thereof, display panel and display device

A technology for array substrates and base substrates, applied in the fields of array substrates, manufacturing methods, display panels, and display devices, can solve the problems of low fingerprint recognition speed and sensitivity, and achieve improved speed and sensitivity, fast response speed, and small size Effect

Active Publication Date: 2022-06-21
BOE TECH GRP CO LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, using photosensitive diodes as photosensitive elements, the speed and sensitivity of fingerprint recognition are not high.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Array substrate, manufacturing method thereof, display panel and display device
  • Array substrate, manufacturing method thereof, display panel and display device
  • Array substrate, manufacturing method thereof, display panel and display device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0046] In order to illustrate the present invention more clearly, the present invention will be further described below with reference to the preferred embodiments and accompanying drawings. Similar parts in the figures are denoted by the same reference numerals. Those skilled in the art should understand that the content specifically described below is illustrative rather than restrictive, and should not limit the protection scope of the present invention.

[0047] Various cross-sectional views according to disclosed embodiments of the present invention are shown in the accompanying drawings. The figures are not to scale, some details have been exaggerated for clarity, and some details may have been omitted. The shapes of the various regions and layers shown in the figures, as well as their relative sizes and positional relationships are only exemplary, and in practice, there may be deviations due to manufacturing tolerances or technical limitations, and those in the art may...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an array substrate, comprising a base substrate; a piezoelectric induction layer formed on the base substrate; a surface acoustic wave exciting electrode and a surface acoustic wave receiving electrode formed on the piezoelectric induction layer; The photosensitive resistance layer formed on the piezoelectric sensing layer, the photosensitive resistance layer is located between the surface acoustic wave excitation electrode and the surface acoustic wave receiving electrode, and the invention also discloses a display panel and a display device including the array substrate , the present invention uses surface acoustic wave excitation electrodes and receiving electrodes with fast response speed, high sensitivity and small volume to realize the fingerprint recognition function, which can improve the speed and sensitivity of fingerprint recognition.

Description

technical field [0001] The present invention relates to the field of display technology. More specifically, it relates to an array substrate, a manufacturing method thereof, a display panel and a display device. Background technique [0002] With the development of science and technology, fingerprint recognition technology is widely used in various electronic devices by virtue of the security identification function it provides. [0003] Existing fingerprint recognition usually detects the reflected light of the finger, and determines whether the corresponding position is the fingerprint valley or the fingerprint ridge according to the difference in the light intensity of the reflected light from the fingerprint valley and the fingerprint ridge, thereby forming a fingerprint image at the corresponding position. In the prior art, photodiodes are usually used to output different photocurrents under different light irradiation, and then a fingerprint image is obtained through ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G06V40/13
CPCG06V40/1318G06V40/1306
Inventor 刘英伟姚琪梁志伟曹占锋任庆荣陈一民
Owner BOE TECH GRP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com