A working method of a semi-automatic cutting device for bakelite board

Abstract

The invention relates to the field of cutting equipment, in particular to a semi-automatic cutting device for a bakelite plate. The semi-automatic cutting device comprises a worktable, a position correction mechanism, a push mechanism and a cutting mechanism; the position correction mechanism comprises a first position correction component, a second position correction component and a limiting component, wherein the first position correction component and the second position correction component are separately arranged at the two ends in the wide side direction of the worktable; the push mechanism comprises a push component and a first driving component; the first driving component is used for driving the push component to move in the long side direction of the worktable; the cutting mechanism comprises a cutter and a second driving component; and the second driving component is used for driving the cutter to move in the width direction of the worktable. The semi-automatic cutting device provided by the invention has the beneficial effects that in a cutting process of the bakelite plate, deviation of the bakelite plate is prevented by virtue of the position correction mechanism, socutting errors of the bakelite plate are prevented, waste of cost in production is reduced, continuous cutting on the bakelite plate can be realized, and the cutting efficiency is improved.

Description

technical field [0001] The invention relates to the field of cutting equipment, in particular to a working method of a semi-automatic cutting device for bakelite boards. Background technique [0002] Bakelite board is also called bakelite board and phenolic laminated paper board. It uses high-quality bleached wood paper and cotton linter paper as reinforcements, and is made of phenolic resin produced by the reaction of high-purity and fully synthetic petrochemical raw materials. It is a wood board made of resin adhesive. Main features: good mechanical strength, anti-static, medium electrical insulation. It is made of insulating impregnated paper impregnated with phenolic resin, baked and hot pressed. [0003] Bakelite boards generally need to be cut according to the size of the bakelite board. Because the surface of the bakelite board is too smooth, it needs to be clamped when cutting, and automatic batch cutting cannot be done. The cutting efficiency is low, and the cutting...

AI Technical Summary

Problems solved by technology

[0003] Bakelite boards generally need to be cut according to the size of the bakelite board. Because the surface of the bakelite board is too smooth, it needs to be clamped when cutting, and automatic batch cutting cannot be done. The cutting efficiency is low, and the cutting time, it is easy to shift, resulting in cutting errors and wasting production costs

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