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Spacer, wafer stack structure, adsorption type moving device and wafer moving method

A technology of mobile devices and stacked structures, applied in transportation and packaging, semiconductor/solid-state device testing/measurement, electrical components, etc., to reduce the probability of damage to the wafer

Inactive Publication Date: 2020-07-03
致茂电子(苏州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of this, the object of the present invention is to provide a gasket, a wafer stacking structure, a suction moving device and a wafer moving method using the same, so that the wafer can be moved through the gasket, so that the wafer can be moved between The process of moving is properly protected to solve the aforementioned problems caused by the traditional manual handling of wafers

Method used

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  • Spacer, wafer stack structure, adsorption type moving device and wafer moving method
  • Spacer, wafer stack structure, adsorption type moving device and wafer moving method
  • Spacer, wafer stack structure, adsorption type moving device and wafer moving method

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Embodiment Construction

[0038] The detailed features and advantages of the present invention are described in detail in the following embodiments, and the content is sufficient to enable any person skilled in the relevant art to understand the technical content of the present invention and implement it accordingly, and according to the content disclosed in this specification, the scope of claims and the accompanying drawings , any person skilled in the related art can easily understand the related objects and advantages of the present invention. The following examples further illustrate the concept of the present invention in further detail, but are not intended to limit the scope of the present invention in any way.

[0039] In addition, the embodiments of the present invention will be disclosed with the accompanying drawings below. For the sake of clarity, many practical details will be described together in the following description. It should be understood, however, that these practical details a...

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Abstract

The invention relates to a spacer, a wafer stacking structure, an adsorption type mobile device and a wafer moving method. The wafer stacking structure comprises at least two spacers and a wafer; eachspacer comprises an inner ring part and an outer ring part; the inner ring part has multiple through holes; the outer ring part surrounds the inner ring part; and the wafer is positioned between thetwo spacers. The invention further discloses an adsorption type mobile device and a wafer moving method, which can be applicable to the wafer stacking structure. Thereby, the wafer can move in a manner of spacing the spacer.

Description

technical field [0001] The present invention relates to a gasket, a wafer stacking structure, an adsorption-type moving device and a wafer moving method using the same, in particular to a gasket for wafer inspection, a wafer stacking structure, an adsorption-type moving device and a wafer moving method. Circle movement method. Background technique [0002] After being cut into thin wafers (wafers) from the crystal pillars, the wafers need to go through a wafer processing process (WaferFabrication), and then go through a needle testing process (Wafer Probe) to find out the unqualified dies on the wafer and follow The needle test results are used to classify the qualified grains. Wherein, before the wafer is subjected to the needle testing process, the processed wafer needs to be moved to a wafer chuck for inspection. [0003] Traditionally, the wafer is manually moved to the wafer chuck, but the manual stability is low, and it is easy to touch the surface of the wafer when ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/677H01L21/683H01L21/66
CPCH01L21/67703H01L21/6838H01L22/14
Inventor 王胜弘王文忠
Owner 致茂电子(苏州)有限公司