A method and device for positioning and bonding of diaphragms
A film and substrate technology, which is applied in the field of film positioning and bonding methods and devices, can solve the problems of not having the function of pre-positioning, increasing the defect rate of products, and being prone to deviation.
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[0051] Embodiments of the present invention provide a film positioning and bonding method and device, which can effectively improve the film bonding efficiency and bonding accuracy.
[0052] In order to make the purpose, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the following The described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0053] see figure 1 , an embodiment of a film positioning and bonding method provided by the present invention, comprising:
[0054] 101. Construct the fi...
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