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A dynamic prediction method of junction temperature of igbt power module

A power module and dynamic prediction technology, applied in geometric CAD, design optimization/simulation, special data processing applications, etc., can solve problems such as junction temperature prediction that can only be used at specific operating points

Active Publication Date: 2022-05-10
BEIJING INSTITUTE OF TECHNOLOGYGY
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Problems solved by technology

[0003] There is mutual coupling between the electric field and the temperature field in the IGBT power module. At the same time, the operating conditions of related circuit parameters in different applications also change in real time. The existing IGBT junction temperature prediction models often ignore the influence of electrothermal coupling, or can only be used for specific The junction temperature prediction at the working point is still insufficient in the application of working conditions

Method used

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  • A dynamic prediction method of junction temperature of igbt power module
  • A dynamic prediction method of junction temperature of igbt power module
  • A dynamic prediction method of junction temperature of igbt power module

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Embodiment Construction

[0067] The technical solutions of the present invention will be further explained in detail below in conjunction with the accompanying drawings.

[0068] Such as figure 1 As shown, the present invention provides a method for dynamically predicting the junction temperature of an IGBT power module, which specifically includes the following steps:

[0069] Step 1. Obtain the torque and speed at the first working point of the motor according to the running state of the motor;

[0070] Step 2. Establish an analytical model of the motor operating point; input the torque and rotational speed obtained in the step 1 into the established analytical model of the motor operating point to obtain dq axis current and voltage values, and then obtain the inverter output three-phase current Voltage, switching signal. Store the grid resistance of the driving end, the switching frequency and the DC bus voltage information of the DC end;

[0071] Step 3. Establish a loss calculation model of th...

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Abstract

The invention provides a method for dynamically predicting the junction temperature of an IGBT power module, which solves the current problems of excessive derating and unreasonable thermal design to avoid failure caused by excessive junction temperature and excessive fluctuation of the IGBT power module. It performs dynamic analysis of circuit parameters including modulation ratio, output current, output voltage, output frequency, etc. according to the operating state of the motor, and inputs the analytical values ​​into the junction temperature calculation model considering electrothermal coupling to realize dynamic junction temperature prediction under working conditions .

Description

technical field [0001] The invention relates to the field of junction temperature prediction of IGBT modules, in particular to a dynamic junction temperature prediction method of an IGBT power module in a three-phase inverter system under working conditions. Background technique [0002] The kHz-level switching frequency characteristics of the IGBT (insulated gate transistor) power module will cause a large heat loss during operation, resulting in the rise and fluctuation of the temperature (junction temperature) at the PN junction of the chip, which will lead to module failure in severe cases . The existing countermeasures are to derate the IGBT module, or match the inverter system where it is located with a radiator with a large mass and volume to fully ensure heat dissipation. However, in the above measures, excessive derating will reduce the application range of the power module, and unreasonable heat dissipation design will also increase the weight of the system and wa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F30/20G06F30/18
CPCG06F30/18G06F30/20
Inventor 张承宁辛欣张硕
Owner BEIJING INSTITUTE OF TECHNOLOGYGY
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