An organic light-emitting display panel and its preparation method
A technology for light-emitting display and organic light-emitting devices, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., and can solve problems affecting the display performance and access of organic light-emitting devices
Active Publication Date: 2020-05-08
BOE TECH GRP CO LTD +1
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Problems solved by technology
[0005] The purpose of the present invention is to provide an organic light-emitting display panel and its preparation method, which are used to solve the problem that water and oxygen enter the thin-film packaging structure of the existing organic light-emitting display panel and affect the display performance of the organic light-emitting device
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[0037] In order to make the purpose, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only some of the embodiments of the present invention, rather than all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0038] The specific implementation manners of the organic light-emitting display panel provided by the embodiments of the present invention, its manufacturing method, and the display device will be described in detail below with reference to the accompanying drawings.
[0039] Wherein, the thickness and shape of each film layer in the drawings do not reflect the real scale, and the purpose is only to illustrate the content of the present...
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Abstract
The invention discloses an organic light-emitting display panel and a preparation method thereof. The organic light-emitting display panel includes a base substrate, an organic light-emitting device on the base substrate, and a package structure. The package structure includes The first isolation layer, the composite functional layer and the second isolation layer arranged on the side of the organic light-emitting device facing away from the base substrate are sequentially stacked; the orthographic projection of the first isolation layer on the base substrate covers the light-emitting The orthographic projection of the device on the base substrate and the boundaries do not overlap; the orthographic projection of the second isolation layer on the substrate covers the orthographic projection of the composite functional layer on the substrate and the boundaries do not overlap; wherein the composite function The layer is a thermally conductive layer that eliminates at least water and oxygen. The arrangement of the composite functional layer can react with the water and oxygen entering the encapsulation structure, and decompose the water and oxygen, thereby preventing the performance of the organic light-emitting device from being affected.
Description
technical field [0001] The present invention relates to the technical field of organic light emitting display panel packaging, in particular to an organic light emitting display panel and a preparation method thereof. Background technique [0002] Electronic devices, especially OLED (Organic Light-Emitting Diode, Organic Light-Emitting Diode) devices are particularly sensitive to moisture and oxygen in the air, so OLED devices need to be packaged to ensure the performance and service life of the device. With the emergence of flexible OLED display panels, thin-film packaging technology has been specifically proposed. On the one hand, it requires the packaging structure to have a strong ability to block water and oxygen. On the other hand, it also requires the packaging structure to be flexible and bendable. This makes the traditional rigid packaging structure unable to meet the demand, and a new packaging form represented by the thin film packaging structure emerges. [0003...
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IPC IPC(8): H01L51/52H01L51/56
CPCH10K50/846H10K50/87H10K50/844H10K71/00
Inventor 刘承俊
Owner BOE TECH GRP CO LTD