Computer mainframe box capable of adjusting heat dissipation

A computer and adjustable technology, applied in computing, instrumentation, electrical digital data processing, etc., to achieve the effect of changing, freely adjusting the wind force in a wide range, and connecting closely

Inactive Publication Date: 2018-06-15
河南趣读信息科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problem in the prior art that the cooling fan in the computer main box can only change its ventilation volume by changing the operating frequency of the fan, and to provide a new type of adjustable cooling fan that can change the ventilation volume of the fan in a large range. computer main box

Method used

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  • Computer mainframe box capable of adjusting heat dissipation
  • Computer mainframe box capable of adjusting heat dissipation
  • Computer mainframe box capable of adjusting heat dissipation

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] A main computer case with adjustable heat dissipation, comprising a case body, in which a heat dissipation fan is arranged, and the heat dissipation fan includes a first drive motor, an adjustment ring is provided on the output shaft sleeve of the first drive motor, and the outer edge of the adjustment ring is adjusted There are multiple groups of fan blades arranged around the ring, and the ends of each group of fan blades are connected with connecting shafts. The connecting shafts are arranged along the radial direction of the adjusting ring and penetrate into the adjusting ring; there is also an inclination angle for driving the connecting shaft to rotate. The adjustment mechanism is connected with each group of connecting shafts with the inclination adjustment mechanism. By setting an inclination adjustment mechanism in the cooling fan, the connecting shaft can be rotated to drive the fan blades to rotate at a certain inclination angle, so that when the first drive m...

Embodiment 2

[0037] On the basis of Embodiment 1, the reclining mechanism includes a linkage assembly and a drive assembly. The linkage assembly includes N sets of second swinging members and at least N-1 sets of second connecting rods. The numbers are equal, each group of second swinging members is sleeved on the corresponding connecting shaft, and N groups of second swinging members are sequentially connected through second connecting rods; the driving assembly is connected with one group of second swinging members and drives the second swinging members to rotate The axis of the corresponding connecting shaft oscillates. When the number of second connecting rods and connecting shafts is set to N-1 groups, there is an opening on one side of the rotating shaft between the second connecting rod and the active swing lever in the adjustment ring; and when the number of second connecting rods and connecting shafts is set to In group N, the second connecting rod in the adjusting ring is connect...

Embodiment 3

[0039] On the basis of Embodiment 2, the drive assembly includes a rotating shaft, one end of the rotating shaft is connected with an active swinging member, and the active swinging member is hinged to one of the second swinging members through an active connecting rod; the other end of the rotating shaft passes through adjustment ring. By rotating the rotating shaft, the rotating shaft drives the active oscillating member to move, and then the second oscillating member moves sequentially through the transmission of the connecting rod, thereby driving the connecting shaft to rotate, thereby changing the inclination angle of the fan blade. The driving assembly operates flexibly, and the overall coordination is effective, and the change of the ventilation volume of the cooling fan is well realized.

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PUM

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Abstract

The invention discloses a computer mainframe box capable of adjusting heat dissipation, and belongs to the technical field of computer heat dissipation. The novel computer mainframe box capable of adjusting heat dissipation can change the ventilation quantity of fans in a large range. The computer mainframe box comprises a mainframe box body, and the cooling fans are arranged in the mainframe boxbody. Each cooling fan comprises a first driving motor, wherein an output shaft of the first driving motor is sleeved with an adjusting ring, a plurality of blades are arranged on the outer edge of the adjusting ring in the circumferential direction of the adjusting ring, the end of each blade is connected with a connecting shaft, and the connecting shafts are arranged in the radial direction of the adjusting ring and penetrate through the adjusting ring. Each cooling fan further comprises inclination angle adjusting mechanisms used for driving the connecting shafts to rotate, and the inclination angle adjusting mechanisms are connected with the connecting shafts. The computer mainframe box has the advantages that the ventilation quantity of the cooling fans can be adjusted in a large range, the internal temperature of the mainframe box body can be better controlled, and a guarantee is provided for good operation of a computer.

Description

technical field [0001] The invention belongs to the technical field of computer heat dissipation, and in particular relates to a main computer case with adjustable heat dissipation. Background technique [0002] With the development of society and the advancement of technology, computers have been widely used in people's lives. The electronic components of the computer will generate a lot of heat when they work. If the heat is not dissipated in a timely and effective manner, the performance of the electronic components in the computer will be greatly reduced and the service life will be shortened, and even the temperature will be too high. Electronic components are damaged. However, most of the existing main computer chassis are relatively closed, and the cooling fans inside the chassis have low working efficiency, so it is difficult to reduce the temperature in the main chassis to a suitable environment. [0003] In order to improve the heat dissipation of the main comput...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/18G06F1/20
CPCG06F1/181G06F1/20
Inventor 刘鹏亚
Owner 河南趣读信息科技有限公司
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