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Air-cooling heat dissipation device

A heat-dissipating device and air-cooling technology, applied in cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc.

Active Publication Date: 2018-06-15
MICROJET TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the heat dissipation efficiency of the aforementioned heat dissipation mechanism is poor, which cannot meet the application requirements

Method used

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Embodiment Construction

[0025] Some typical embodiments embodying the features and advantages of the present application will be described in detail in the description in the following paragraphs. It should be understood that this case can have various changes in different aspects, all of which do not depart from the scope of this case, and the descriptions and diagrams therein are used as illustrations in nature, rather than construed to limit this case.

[0026] see figure 2 , which is a schematic structural diagram of the air-cooling heat dissipation device of the first preferred embodiment of the present application. Such as figure 2As shown, the air cooling device 2 of this case can be applied to an electronic device, such as but not limited to a portable computer, a tablet computer, an industrial computer, a portable communication device, an audio-visual player, etc., but not limited thereto , and used to dissipate heat from the heat source in the electronic device. Taking this embodiment as ...

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PUM

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Abstract

The invention provides an air-cooling heat dissipation device. The device includes a carrier, a vortex air flow radiator, a gas pump, and a channel connector; the carrier is disposed at one side of anelectronic component and includes an air-guiding end opening and an air-discharging end opening; the vortex air flow radiator is attached to the electronic component and is of a structure with a vortex air flow channel composed of a vortex-shaped conductor wire rod and a heat-conducting plate; the gas pump is disposed on the carrier; with the air-guiding end opening of the carrier closed, the gaspump and the carrier can define a cavity; the channel connector is connected between the carrier and the vortex air flow channel; the gas pump is driven to guide and feed a gas into the cavity of thecarrier; the gas is guided to the vortex air flow channel through the air-discharging end opening and the channel connector, so that vortex rapid air flow can be formed, and therefore, heat exchangecan be performed on the electronic component; the air flow which has been subjected to heat exchange is discharged through the air-discharging opening of the vortex air flow radiator.

Description

【Technical field】 [0001] This case relates to an air cooling and heat dissipation device, especially an air cooling and heat dissipation device that uses a gas pump to provide driving airflow for heat dissipation. 【Background technique】 [0002] With the advancement of technology, various electronic devices such as portable computers, tablet computers, industrial computers, portable communication devices, audio-visual players, etc. have developed towards thinner, portable and high-performance trends. These electronic devices Various high-integration or high-power electronic components must be arranged in its limited internal space. In order to make the electronic equipment faster and more powerful, the electronic components inside the electronic equipment will generate more heat during operation. , and lead to high temperature. In addition, most of these electronic devices are designed to be thin, flat and compact, and there is no additional internal space for heat dissipat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20145
Inventor 徐振春江贵良林永康黄启峰韩永隆
Owner MICROJET TECH