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A structure of the inlet shunt of a printed circuit board heat exchanger

A technology for printed circuit boards and heat exchangers, which is applied in the direction of heat exchanger pipes, heat exchanger shells, heat exchange equipment, etc. Hot channel flow distribution and other issues to achieve the effect of improving uneven flow distribution

Active Publication Date: 2019-11-26
INST OF ENGINEERING THERMOPHYSICS - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The fluid heat exchange channel on the printed circuit board heat exchanger plate is small in size. When multiple heat exchange channels are arranged side by side, the structural design of the existing inlet shunt affects the flow distribution in the heat exchange channel, thereby affecting Overall performance of the heat exchanger

Method used

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  • A structure of the inlet shunt of a printed circuit board heat exchanger
  • A structure of the inlet shunt of a printed circuit board heat exchanger
  • A structure of the inlet shunt of a printed circuit board heat exchanger

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Embodiment Construction

[0024] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be described in further detail below with reference to the accompanying drawings and embodiments. It should be noted that the implementations not shown or described in the accompanying drawings are the forms known to those of ordinary skill in the art. In addition, the directional terms mentioned in the following embodiments, such as "up", "down", "front", "rear", "left", "right", "top", "bottom", etc., are only for reference the direction of the figure. Accordingly, the directional terms used are illustrative and not limiting of the present invention.

[0025] like figure 1 As shown, the structure of the inlet splitter of the printed circuit board heat exchanger of the present invention includes a plurality of parallelly arranged inlet diversion channels 10 and a plurality of parallel arranged heat exchange channels 20, which are arranged o...

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Abstract

The invention discloses a printed circuit board heat exchanger inlet flow-distributing part structure. When a certain included angle exists between an inlet flow-guiding channel and a heat exchange channel, a structure that a single flow-guiding channel corresponds to multiple heat exchange channels is adopted, and meanwhile, a gradient of an inlet end face of each heat exchange channel is changed, so that the included angle between each heat exchange channel and the flow-guiding channel is moderate, flow-distributing ribs among the heat exchange channels can effectively carry an income fluid,the fluid can be prevented from being excessively concentrated in the single channel, and the phenomenon of nonuniformity in channel flow distribution is improved. On the basis, the indentation of the ribs from the heat exchanger inlet end faces is changed, so that the phenomenon of nonuniformity in flow distribution in the channels can be effectively improved.

Description

technical field [0001] The present invention relates to the technical field of printed circuit board heat exchangers, in particular, to a structure at the inlet of the printed circuit board heat exchanger. Background technique [0002] The printed circuit board heat exchanger is a high-temperature and high-pressure, high-efficiency compact heat exchanger, which usually includes a plurality of stacked heat exchange plates, and the main part of each heat exchange plate is processed by etching or machining. There are many tiny fluid heat exchange channels, and the inlet and branch of the heat exchange channels are usually etched or machined with diversion channels corresponding to the heat exchange channels one-to-one. hot core. Due to its compact structure and efficient heat exchange performance, printed circuit board heat exchangers can be used in many fields. The size of the fluid heat exchange channel on the heat exchanger plate of the printed circuit board is relatively ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F28F9/22
CPCF28F9/22F28F2210/00
Inventor 郭江峰崔欣莹淮秀兰成克用张海燕相梦如
Owner INST OF ENGINEERING THERMOPHYSICS - CHINESE ACAD OF SCI